Zobrazeno 1 - 10
of 39
pro vyhledávání: '"Ji-guang Han"'
Autor:
Ming Niu, Ming Shan, Yang Liu, Yanni Song, Ji-guang Han, Shanshan Sun, Xiao-shuan Liang, Guo-qiang Zhang
Publikováno v:
Frontiers in Oncology, Vol 11 (2021)
Breast cancer (BRCA) is one of the most deadly cancers worldwide, with poor survival rates that could be due to its high proliferation. Human all-alpha dCTP pyrophosphatase 1 (DCTPP1) is implicated in numerous diseases, including cancers. However, it
Externí odkaz:
https://doaj.org/article/d5c8dbdb6b2a43429b8bc6b652505324
Autor:
Ji-guang Han, Zhen-zhi He
Publikováno v:
DEStech Transactions on Engineering and Technology Research.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d50c48d55a660a250fffe0bdd98f6b7f
https://doi.org/10.12783/dtetr/amee2018/25302
https://doi.org/10.12783/dtetr/amee2018/25302
Publikováno v:
Journal of Materials Science: Materials in Electronics. 26:6194-6197
The relationship between Ce content/CeSn3 sizes and the whiskers growth is newly reported systematically. The whiskers growth can be observed in the surface of bulk CeSn3 particles, the rate of whisker growth was significantly slowed with Ce content
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4518bbb923df326b289386c62927dfd4
https://doi.org/10.1007/s10854-015-3202-1
https://doi.org/10.1007/s10854-015-3202-1
Publikováno v:
Journal of Materials Science: Materials in Electronics. 26:3615-3620
In our previous work, a small amount of Al nanoparticles can improve the wettability and mechanical properties of SnAgCu lead-free solders. In this paper, creep properties of SnAgCu solder alloys containing 0.1 wt% Al nanoparticles were studied based
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efe3cb58d787346c17dd023216f7a91f
https://doi.org/10.1007/s10854-015-2876-8
https://doi.org/10.1007/s10854-015-2876-8
Publikováno v:
Journal of Materials Science: Materials in Electronics. 26:2605-2608
In this paper, the wettability of lead-free solders on substrates with fluxes was studied based on reflow process and Taguchi method. Effects of different control factors, including solder materials, fluxes, substrate materials and atmosphere on the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87be18f5afa769c19f6d2a26b6f6da09
https://doi.org/10.1007/s10854-015-2730-z
https://doi.org/10.1007/s10854-015-2730-z
Publikováno v:
Mechatronics and Manufacturing Technologies.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed2c5812c9baf1ae5ad8c23616ac5ece
https://doi.org/10.1142/9789813222359_0020
https://doi.org/10.1142/9789813222359_0020
Publikováno v:
Mechatronics and Manufacturing Technologies.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0dee076eba16501c360327907c62786
https://doi.org/10.1142/9789813222359_0019
https://doi.org/10.1142/9789813222359_0019
Publikováno v:
Solar Energy Materials and Solar Cells. 130:397-400
In order to improve the reliability of solar cell solder joints, rare earth Eu was selected as the additive into SnAgCu solders; the properties and microstructure of SnAgCu– x Eu were studied systematically. The results indicated that the addition
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b688e01d62d116c001adf5f0f2d878ba
https://doi.org/10.1016/j.solmat.2014.07.034
https://doi.org/10.1016/j.solmat.2014.07.034
Publikováno v:
International Journal of Nonlinear Sciences and Numerical Simulation. 15:405-410
In this paper, we research the thermo-mechanical reliability of lead-free solder joints in WLCSP assembly subjected to an accelerated thermal cyclic loading based on finite element simulation and Taguchi method. Effects of different control factors,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::17c46a4c1638ac51c1f558c9597f3ed7
https://doi.org/10.1515/ijnsns-2014-0062
https://doi.org/10.1515/ijnsns-2014-0062
Publikováno v:
Journal of Materials Science: Materials in Electronics. 25:4489-4494
Finite element simulation and experiments were used to analyze the reliability of SnAgCu/SnAgCuCe solder joints with different heights. With the increase of height of solder joints, the tensile strength of SnAgCu and SnAgCuCe solder joints drops sign
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::734e3115cd781d038205be29129965b1
https://doi.org/10.1007/s10854-014-2192-8
https://doi.org/10.1007/s10854-014-2192-8