Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Ji-Cheng Lin"'
Autor:
Ji-Cheng Lin, 林基正
91
In order to meet the needs of electronic products, various packaging techniques such as TSOP, BGA, Flip Chip, and WLCSP are actively being developed. However, it is rather difficult to quickly and effectively analyze each new design that show
In order to meet the needs of electronic products, various packaging techniques such as TSOP, BGA, Flip Chip, and WLCSP are actively being developed. However, it is rather difficult to quickly and effectively analyze each new design that show
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/14998766126085204219
Autor:
Ji-Cheng Lin, 林基誠
87
For wear reduction, the application of bearing is widely used in industry. There are two parts of ambit: rolling bearing and sliding bearing. The unique lubrication property of solid lubricant drive our attention to its application to rolling
For wear reduction, the application of bearing is widely used in industry. There are two parts of ambit: rolling bearing and sliding bearing. The unique lubrication property of solid lubricant drive our attention to its application to rolling
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/55054110559078245944
Autor:
Pin-Zhong Shen, Ji-Cheng Lin, Hsi-Tseng Chou, Chieh-Wei Chou, Chao-Shun Yang, Zhao-He Lin, Kuan-Hsun Wu, Chi-Liang Pan, Ding-Bing Lin, Li-Chih Fang
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Realization of Antenna-in-Package (AiP) needs to resolve several performance instability challenges at millimeterwave (mmW) frequencies. They are caused by the uncertainties of material properties and mechanical fabrication limitations. In particular
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1eff28c7616f4498a3cd125acfb6858d
https://doi.org/10.1109/ectc32696.2021.00102
https://doi.org/10.1109/ectc32696.2021.00102
Autor:
Chun-Te Lin, Pin-Zhong Shen, Chi-Liang Pan, Li-Chih Fang, Zhao-He Lin, Ding-Bing Lin, Ji-Cheng Lin, Hsi-Tseng Chou, Chao-Shun Yang, Chieh-Wei Chou
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Design of Antenna-in-Module (AiM) is presented to realize active and reconfigurable antenna arrays for potential 5G applications at millimeter-wave (mmW) frequencies. Due to the large array configuration, transmission line loss in the dielectric subs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5e25f1b9bb930f3c48241a70dd109f1
https://doi.org/10.1109/ectc32696.2021.00286
https://doi.org/10.1109/ectc32696.2021.00286
Autor:
Chao-Shun Yang, Li-Chih Fang, Ji-Cheng Lin, Hsi-Tseng Chou, Ding-Bing Lin, Chi-Liang Pan, Zhao-He Lin, Chun-Te Lin, Kuan-Hsun Wu, Chieh-Wei Chou, Pin-Zhong Shen
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this paper, an active antenna-in-package (AiP) design at millimeter wave frequencies (mmW) is presented for user equipment (UE) and customer-premises equipment (CPE) applications. In particular, the UE and CPE AiP implements 4 × 4 and 6 × 6 micr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc1f6150a3d2c53f9da7276a1c283df8
https://doi.org/10.1109/ectc32862.2020.00104
https://doi.org/10.1109/ectc32862.2020.00104
Publikováno v:
Applied Mechanics and Materials. :1568-1573
By applying the Matlab software ,the Lohmann Ⅲ and Burch encoding method are used to achieve the Fourier transform hologram respectively. The computer simulation reconstruction of the hologram is achieved. The characteristic of the Lohmann Ⅲ and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d93da2c9a300464fcd18644ec818328
https://doi.org/10.4028/www.scientific.net/amm.263-266.1568
https://doi.org/10.4028/www.scientific.net/amm.263-266.1568
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 28:117-126
Wafer level chip scale packaging (WLCSP) is very promising for the miniature of packaging size, the reduction of manufacturing cost, and the enhancement of the package's performance. However, the long-term board level reliability of integrated circui
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0dab04a635c928408b86d12f5ed4119b
https://doi.org/10.1109/tcapt.2005.843216
https://doi.org/10.1109/tcapt.2005.843216
Publikováno v:
Sensors and Actuators A: Physical. 119:28-37
By applying the etching via technology, this study proposes a novel front-side etching fabrication process for a silicon-based piezoresistive pressure sensor to replace the conventional back-side bulk micro-machining. This novel structure pressure se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2cf29a27b698bf1e3a8a7f8fffb16653
https://doi.org/10.1016/j.sna.2004.08.013
https://doi.org/10.1016/j.sna.2004.08.013
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 27:684-693
The geometry of solder joints in the flip chip technologies is primarily determined by the associated solder volume and die/substrate-side pad size. In this study, the effect of these parameters on the solder joint reliability of a fine-pitched flip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a1e829089df5aa5c0296165bf1dcfd70
https://doi.org/10.1109/tcapt.2004.838867
https://doi.org/10.1109/tcapt.2004.838867
Publikováno v:
Journal of the Chinese Institute of Engineers. 27:955-964
In this study, a packaged silicon base piezoresistive pressure sensor with thermal stress buffer is designed, fabricated, and studied. A finite element method (FEM) is adopted for designing and optimizing the sensor performance. Thermal and pressure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21a3777880370c3244f42445f1b70506
https://doi.org/10.1080/02533839.2004.9670950
https://doi.org/10.1080/02533839.2004.9670950