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pro vyhledávání: '"Ji Ni Shim"'
Autor:
Jong Heon Kim, Sang Yong Park, Ji Ni Shim, Kwon Yongtae, Ju Hyun Nam, Chang Woo Lee, Nam Chul Kim, Jun Kyu Lee
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In this paper, the development of a new optical chip in board (CiB) package adapting Fan-out technology that offers thermal, electrical and thin structure benefit was reported. Optical CiB package contain 4 optical die and is made smaller and thinner
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::506dfee6a193f5cb88f1617d20df50dd
https://doi.org/10.1109/ectc.2019.00091
https://doi.org/10.1109/ectc.2019.00091
