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Evaluation and verification of enhanced electrical performance of advanced coreless flip-chip BGA package with warpage measurement data

Autor: Chul Woo Park, Glenn A. Rinne, Choonheung Lee, Ga Won Kim, Ji Heon Yu, Jin Young Kim, Seoung Joon Hong

Publikováno v: 2012 IEEE 62nd Electronic Components and Technology Conference.

In this paper, the 8+1-layer coreless substrate of fcBGA will be introduced, which was revised from the 12-layer core substrate. This coreless substrate was manufactured in Shinko using an advanced ABF film (GZ41) having low CTE for lower warpage and

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::65e2f96ae5bf3a3e395afbe9a13638a8
https://doi.org/10.1109/ectc.2012.6248941

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