Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Ji Hao Hoo"'
Publikováno v:
Journal of Microelectromechanical Systems. 23:579-584
This paper presents the first proof-of-concept 3D integration using fluidic self-assembly of chip-scale parts (2000 $\,\times\,$ 2000 $\,\times\,$ 100 $\mu{\rm m}^{3}$ ) at an air-water-solid interface. Four-layer 3D integration is achieved by assemb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2f00b7c5d30e88a862aadf3d022b036
https://doi.org/10.1109/jmems.2013.2291235
https://doi.org/10.1109/jmems.2013.2291235
Publikováno v:
Journal of Microelectromechanical Systems. 22:662-669
This paper details the effect of fluid viscosity on previously presented self-assembly at an air-water-solid interface through experimental and analytical approaches. The assembly method is subdivided into three process steps (approach, rotation, and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3df6b7e213a4ffceadd9454fe4071777
https://doi.org/10.1109/jmems.2013.2239257
https://doi.org/10.1109/jmems.2013.2239257
Publikováno v:
Journal of Microelectromechanical Systems. 22:13-15
This letter presents an analysis of self-assembly of thin disk-shaped parts (diameter: 2 mm; thickness: 100 μm) with the objective of optimizing their angular alignment. The assembly proceeds continuously on a substrate that is pulled up through an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26fd97293515e64ce0f289ee48d4edb5
https://doi.org/10.1109/jmems.2012.2231052
https://doi.org/10.1109/jmems.2012.2231052
Publikováno v:
Journal of Microelectromechanical Systems. 21:1273-1275
This letter reports a novel methodology for the orientation-specific parallel heterogeneous integration of parts of various sizes. Assembly sites are designed to only attract specific parts from an unsorted pool using the combined effect of Faraday w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51a1a7efdb9e0b11d406d65f4c364892
https://doi.org/10.1109/jmems.2012.2205905
https://doi.org/10.1109/jmems.2012.2205905
Publikováno v:
2012 Solid-State, Actuators, and Microsystems Workshop Technical Digest.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6110f06b27d8cb38ecdd316ff2f52b6d
https://doi.org/10.31438/trf.hh2012.112
https://doi.org/10.31438/trf.hh2012.112
Publikováno v:
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS).
This paper reports a novel method to deliver and assemble standard 01005 format (0.016” × 0.008”, 0.4 mm × 0.2 mm) monolithic ceramic capacitors and thin-film resistors into through-wafer trenches, with a batch assembly process that can guarant
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8087547e11ad60986047ab8b88e1c14b
https://doi.org/10.1109/memsys.2012.6170161
https://doi.org/10.1109/memsys.2012.6170161
Publikováno v:
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.
We present microscale self-assembly as a suite of techniques that promotes the electronics industry's initiative towards functional diversification and function densification, and two specific programmable self-assembly projects that are driven by re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::107fad09c4986cf7d7f3291cb210b845
https://doi.org/10.1109/transducers.2011.5969886
https://doi.org/10.1109/transducers.2011.5969886
Publikováno v:
TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.
This paper demonstrates a novel method to perform micropart (370×370×150µm3) delivery to receptor sites (20×10 array) with a batch assembly process that leads to 100% yield within tens of seconds. The delivery mechanism is statistically character
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4faf57de7e577d454e9c4af69f9a2f6a
https://doi.org/10.1109/sensor.2009.5285762
https://doi.org/10.1109/sensor.2009.5285762
Publikováno v:
2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.
We enhance the efficiency of assembly of microparts in batch dry assembly methods studied previously by our group. Here we study the system dynamics with the addition of a few non-participating millimeter scale parts that act as 'catalysts'. We prese
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a3c1da00412d60b9567b5387b54cfe7
https://doi.org/10.1109/memsys.2008.4443844
https://doi.org/10.1109/memsys.2008.4443844
Publikováno v:
Journal of Micromechanics and Microengineering. 24:045018
We present template-based microscale self-assembly as a technique that promotes the electronics industry's initiative towards functional diversification and function densification, demonstrating that our process can improve existing assembly and pack
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff2fee2b86c2dd66b894d6ddcd73d81b
https://doi.org/10.1088/0960-1317/24/4/045018
https://doi.org/10.1088/0960-1317/24/4/045018