Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Jesse A. Salen"'
Autor:
M. Bruce, V. Bruce, Nicholas Antoniou, Jeffrey D. Birdsley, Rama R. Goruganthu, M.A. Thompson, R. Ring, Glen Gilfeather, Jesse A. Salen
Publikováno v:
1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).
Design debug through circuit modification on flip chip packaged ICs requires controlled thinning of substrate silicon. A laser-based tool and methodology for rapid controlled removal of silicon is described. This etching process uses a focused laser
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::09be21c504d9d9d660ce49fac1224fed
https://doi.org/10.1109/relphy.1999.761634
https://doi.org/10.1109/relphy.1999.761634
Autor:
Drew Barnes, Kathryn Noll, Gregory J. Athas, J. David Casey, Don E. Yansen, Neil J. Bassom, Jesse A. Salen
Publikováno v:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V.
We demonstrate an approach to cross-section and measure sub- 0.25 micrometer photoresist profiles in both a manual and an automated fashion. This approach includes the use of a focused ion beam (FIB) system to cut small trenches through photoresist l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59507c22d18db1067373d38da41b2592
https://doi.org/10.1117/12.361311
https://doi.org/10.1117/12.361311
Publikováno v:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV.
We present the ability of a focused ion beam system (FIB) to perform as an effective metrology tool. This feature is a benefit in areas where FIB technology is or can be used, or where pre-measurement cross-sectioning is required, such as the case in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd179c8e27d5b236bef9f0552e6f8d0f
https://doi.org/10.1117/12.324349
https://doi.org/10.1117/12.324349
Autor:
Rama R. Goruganthu, David Casey, M.A. Thompson, Glen Gilfeather, Jesse A. Salen, Nicholas Antoniou, Jeff Birdsley, Rose Ring
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 17:2730
Complex logic chips are almost exclusively assembled in flip chip packaging. This type of assembly complicates traditional debug and circuit modification techniques. Development of new applications and new equipment now enable precise access to the c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94cef4f8135f3db58a4ffb02953cb8c5
https://doi.org/10.1116/1.590926
https://doi.org/10.1116/1.590926
Conference
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.