Zobrazeno 1 - 6
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pro vyhledávání: '"Jesús Ruano"'
Akademický článek
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Publikováno v:
AIAA Journal. 61:612-625
An investigation of various eddy viscosity models for accurate scale-resolving simulation of aerodynamics and aeroacoustics of a turbulent jet is presented. The models are considered from the perspective of solving the so-called gray area problem. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::613913272f989776e0049c44d1b46b3c
https://doi.org/10.2514/1.j062116
https://doi.org/10.2514/1.j062116
Autor:
Carmen García-Ruiz, Fernando Ortega-Ojeda, Manuel Jesús Ruano-Rando, Gemma Montalvo, Manuel José Chamorro-Sancho, Félix Zapata, José Luis Ferrando-Gil, Irene Burgos-Díez
Publikováno v:
e_Buah Biblioteca Digital Universidad de Alcalá
instname
instname
Current methods used in terminal ballistics to determine the volume of temporary cavities created by projectiles in soft tissue simulants (such as ballistic soap) usually involve silicone-casting to obtain the cavity moulds. However, these methods ha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::348b103603ec19100a700979503ed353
http://hdl.handle.net/10017/51274
http://hdl.handle.net/10017/51274
Autor:
Maria Tijero, Francisco J. Blanco, Jesús Ruano, Javier Berganzo, M.T. Arroyo, J. Garcia, K Mayora, Inigo Aramburu, Maria Agirregabiria
Publikováno v:
Journal of Micromechanics and Microengineering. 14:1047-1056
This paper describes a novel fabrication method for the manufacture of three-dimensional (3D) interconnected microchannels. The fabrication is based on a full wafer polymer bonding process, using SU-8 polymer epoxy photoresist as a structural materia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7f42a67588409a86eb929783a4fd611
https://doi.org/10.1088/0960-1317/14/7/027
https://doi.org/10.1088/0960-1317/14/7/027
Autor:
K. Mayora, Maria Agirregabiria, M. Tijero, Javier Berganzo, María Antonia Ramos Arroyo, Jesús Ruano, Inigo Aramburu, Francisco J. Blanco, J. Garcia
Publikováno v:
SPIE Proceedings.
This article describes a novel low temperature full wafer adhesive bonding process to fabricate three-dimensional (3-D) embedded microchannels using SU-8 photoresist as structural material. The technology development includes an improvement of the SU
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f022850886d6103bfe2f3f8e0349b96b
https://doi.org/10.1117/12.522287
https://doi.org/10.1117/12.522287
Akademický článek
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