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pro vyhledávání: '"Jerry Z. Y. Guo"'
Autor:
F. Cerrina, Jerry Z. Y. Guo
Publikováno v:
IBM Journal of Research and Development. 37:331-350
Advanced semiconductor circuits, such as DRAMs, are based on very complex fabrication processes. Because of the cost and complexity involved, it is rapidly becoming impossible to adopt a "trial-and-error" approach in the development stage of a new pr
Autor:
Anthony E. Novembre, George K. Celler, David N. Tomes, Jerry Z. Y. Guo, J. Frackoviak, Joseph A. Abate, Allen G. Timko, Herschel Maclyn Marchman
Publikováno v:
SPIE Proceedings.
In this paper, the effect of resist contrast on the exposure latitude, printing bias, and dark erosion are discussed in the context of proximity x-ray lithography. Positive chemically amplified resists are studied. Both experimental and simulation re
Autor:
Jerry Z. Y. Guo, Franco Cerrina
Publikováno v:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing III.
The effect of absorber sidewall roughness on image formation in proximity X-ray lithography is studied based on simulation of the propagation of X-rays within the absorber and the diffraction of light over a proximity gap. We conclude that the absorb
Publikováno v:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing III.
The aberrations of a typical condenser system for proximity X-ray lithography are obtained through ray-tracing and their effect on the overlay and linewidth control is analyzed. The main effect of the illumination systems aberrations is run-out error
Autor:
Jerry Z. Y. Guo, Franco Cerrina
Publikováno v:
SPIE Proceedings.
The characteristics of sources for x-ray lithography are analyzed in terms of image formation. In particular, laser-induced plasma and synchrotron radiation sources are compared. New design considerations are presented for both types of sources, and
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 12:4044
In proximity x‐ray lithography, wavelengths in the range of 4–20 A are used. The choice of wavelength is a complicated system issue, which depends on many lithographic aspects. Shorter wavelength x rays offer aerial image diffraction advantages.
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 12:3585
Increased performance of lithographic process techniques has been the key enabler for the continued reduction of minimum device feature sizes down to 0.25 μm and beyond. However, this increase in performance has been accompanied by the added fabrica
Autor:
E. Di Fabrizio, J. Frank, Jerry Z. Y. Guo, Franco Cerrina, Massimo Gentili, Q. Leonard, L. Luciani
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 11:2902
Depth‐of‐focus (gap latitude in proximity lithography) and exposure latitude are the two most important figures‐of‐merit for linewidth control in lithography. In a recent article, the preliminary result of the experimental verification of thi
Autor:
Massimo Gentili, L. Luciani, E. Di Fabrizio, Jerry Z. Y. Guo, Franco Cerrina, David Gerold, Q. Leonard
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 10:3150
The successful application of x‐ray lithography to a manufacturing process requires a detailed understanding of the image formation process. In a series of articles, a theoretical study of the optical processes involved in the definition of the ima
Autor:
Jerry Z. Y. Guo, Franco Cerrina
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 9:3207
The image formed in proximity x‐ray lithography is normally computed using a physical optics model that takes in explicit account diffraction processes. It is important to understand the assumption implicit in the various models and the effects tha