Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Jerry Aw Jie Li"'
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
In this paper, authors developed miniaturizeddouble side cooling packaging for SiC (silicon carbide) highpower inverter module using new material solutions towithstand high temperature condition over 220oC. Instead ofconventional thick wire bonding o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6589bdc2e2773bf709c1894279da6eb
https://doi.org/10.1109/ectc.2016.396
https://doi.org/10.1109/ectc.2016.396
Publikováno v:
International Journal of Mechanical Engineering and Robotics Research.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::748feb89837eb423def0693c7a6e6fcc
https://doi.org/10.18178/ijmerr.5.4.276-279
https://doi.org/10.18178/ijmerr.5.4.276-279
Autor:
X. Liu, Mervi Paulasto-Kröckel, Mikael Broas, Jerry Aw Jie Li, Toni T. Mattila, Antti Peltonen, Yanling Ge
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
MEMS microphones are widely utilized in commercial applications such as mobile phones and laptops. Microphones cannot be sealed completely from the atmosphere since sensing requires propagation of sound waves to the sensing element. Therefore, the se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6998fa232d42ed99d02333a46e3f4989
https://doi.org/10.1109/ectc.2015.7159630
https://doi.org/10.1109/ectc.2015.7159630
Autor:
Jerry Aw Jie Li, Ho Siow Ling, Daniel Rhee Min Woo, Lee Jong Bum, Zhang Songbai, Hwang How Yuan
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
The SiC based high power 3 phase inverter module with double side cooling structure was developed. By applying flipchip bonding of SiC based high power DMOSFET device on DBC substrate, the source and gate bonding could be achieved. The drain intercon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5fb339458533445c5db76715d6d8ba50
https://doi.org/10.1109/eptc.2014.7028383
https://doi.org/10.1109/eptc.2014.7028383
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
A wafer level under-fill (WLUF) process for ultra-fine Cu-Cu bonding is developed. Under-fill is applied as pre-applied under-fill then planarized the surface. The methodology used for surface planarization (bit grinding) and surface treatment (H2 pl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d29cda1c134b5b3f5076288b96a1c8a8
https://doi.org/10.1109/eptc.2014.7028388
https://doi.org/10.1109/eptc.2014.7028388
Autor:
Aloke Paul, Jerry Aw Jie Li, Vesa Vuorinen, Juha Karppinen, Tomi Laurila, Mervi Paulasto-Kröckel
Publikováno v:
IndraStra Global.
The effect of different pre-aging treatments on the microstructural evolution of lead-free solder and growth of interfacial intermetallic compound layers under thermal cycling has been investigated in this work. The results show that there are distin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::142a76cee396d065f636cbc1b758ebfc
https://igi.indrastra.com/items/show/199406
https://igi.indrastra.com/items/show/199406
Autor:
Toni T. Mattila, H. Hyvonen, Jerry Aw Jie Li, Mervi Paulasto-Kröckel, Jani Raami, Jussi Hokka, Joonas Makkonen, Mikael Broas
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
Despite the fact that MEMS devices have become common in many electronic products, methods for their reliability assessment are still undeveloped. One significant difference to the reliability assessment of conventional electronic component boards is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab58317950d41147de82d2caee9fc1fa
https://doi.org/10.1109/ectc.2012.6248807
https://doi.org/10.1109/ectc.2012.6248807