Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Jerome Teysseyre"'
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Board-level thermal cycling reliability performance of two buckets of discrete power packages is evaluated by both Finite Element Analysis (FEA) and an actual test. One bucket consists of smaller size packages and the other consists of bigger size pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10f2e173f321de39b4be48dc4708997d
https://doi.org/10.1109/ectc.2016.292
https://doi.org/10.1109/ectc.2016.292
Autor:
Pandi C. Marimuthu, Yaojian Lin, Xavier Baraton, Yonggang Jin, Jerome Teysseyre, Seung Wook Yoon
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001507-001526
Current and future demands of mobile/portable electronic systems in terms of performance, power consumption, reliable system at a reasonable price are met by developing advanced/appropriate silicon process technology, innovative packaging solutions w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d36f5961529ff937f8d71f5c4080fd1
https://doi.org/10.4071/2012dpc-wa22
https://doi.org/10.4071/2012dpc-wa22
Publikováno v:
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
In this paper, a 3-D finite element (FE) model was established to simulate the dynamic vibration in lead frame of molded leaded package (MLP during wire bonding process. The dynamic vibration response in the MLP will be examined. Four lead frame desi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fcf0b77ca1f5848a694316cb4ad64f4
https://doi.org/10.1109/icept.2015.7236599
https://doi.org/10.1109/icept.2015.7236599
Publikováno v:
Materials Science and Engineering: B. 83:158-164
We report on the effects of hydrothermal ageing on the dielectric properties of epoxy-silica composites used for microelectronic packaging. The study was carried out for samples with various degrees of curing. Epoxy compounds were subjected to moistu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1eb91eda3eedd68e8b931441b30091ad
https://doi.org/10.1016/s0921-5107(01)00521-9
https://doi.org/10.1016/s0921-5107(01)00521-9
Publikováno v:
Journal of Materials Science: Materials in Electronics. 12:81-86
We studied the dielectric properties (dielectric constant and loss factor) of epoxy molding compounds used for electronic packaging, as a function of frequency (100 Hz–100 kHz) and temperature (25–100 °C). Studies were performed for samples with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c7b40dee6f01515f029d11fa259dac0
https://doi.org/10.1023/a:1011241818209
https://doi.org/10.1023/a:1011241818209
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
System-in-Package (SiP) which combines different chips and technologies into a single package is a viable solution to meet the rigorous requirements for today's mixed signal system integration. As the level of integration increases, challenges relate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3127ac60dc1c0d590019cadaa2a45b4c
https://doi.org/10.1109/eptc.2013.6745793
https://doi.org/10.1109/eptc.2013.6745793
Autor:
Seung Wook Yoon, Yonggang Jin, Xavier Baraton, Jerome Teysseyre, Pandi C. Marimuthu, Yaojian Lin
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
The shrinkage of the pitches and pads at the chip to package interface is happening much faster than the shrinkage at the package to board interface. This interconnection gap requires fan-out packaging, where the package size is larger than the chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e42b01f265fa8533dd3e29b0b9abea6f
https://doi.org/10.1109/ectc.2012.6249017
https://doi.org/10.1109/ectc.2012.6249017
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
In this paper, we will compare Cu wire and Au wire behavior during pull test and package reliability test through thermo-mechanical simulation. Relationship between wire pull test and package reliability test, i.e. thermal cycling, is also evaluated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::00aad9af2f3a2c5e02ad765aafbfd290
https://doi.org/10.1109/eptc.2011.6184378
https://doi.org/10.1109/eptc.2011.6184378
Publikováno v:
Proc.7th Electronics Packaging Technology Conference (EPTC 2005)
Proc.7th Electronics Packaging Technology Conference (EPTC 2005), 2005, Singapore
Scopus-Elsevier
Proc.7th Electronics Packaging Technology Conference (EPTC 2005), 2005, Singapore
Scopus-Elsevier
In this work, we present the potentialities of the surface potential method to investigate electrostatics charges deposited on epoxy resins used in packaging. Curing and post-mould-curing (PMC), with various durations have been performed on epoxy res
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9419b9bab370f3da6f262425faf51527
https://doi.org/10.1109/eptc.2005.1614498
https://doi.org/10.1109/eptc.2005.1614498
Autor:
Fong Kuan Ng, Jerome Teysseyre, Say Chye Joachim Loo, Tong Yan Tee, Xueren Zhang, Subodh Mhaisalkar, Xinyu Du, Wenhui Zhu, Hun Shen Ng, Chwee Teck Lim, S. Chew, E. Bool
Publikováno v:
Scopus-Elsevier
Package reliability is a great concern in developing new advanced packages. This paper presents some of the modeling and testing activities for the design of mixed flip-chip (FC)-wire bond (WB) stacked die BGA module with molded underfill (MUF). The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::40d84111ee98de1cc5606f743efb0894
https://doi.org/10.1109/ectc.2005.1441267
https://doi.org/10.1109/ectc.2005.1441267