Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Jeroen Bielen"'
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 4, Iss 6, Pp 459-465 (2016)
This paper presents on-wafer capacitance measurements of silicon-based RF MEMS capacitive switches down to frequencies below 1 Hz. The capacitance-voltage (C-V) curve measured at very-low frequency (0.01-10 Hz) deviates from the commonly measured and
Externí odkaz:
https://doaj.org/article/212424ba67014e80874ea3851f412b88
Publikováno v:
Journal of the Electron Devices Society, 4(6), 459-465. IEEE
IEEE Journal of the Electron Devices Society, Vol 4, Iss 6, Pp 459-465 (2016)
IEEE Journal of the Electron Devices Society, Vol 4, Iss 6, Pp 459-465 (2016)
This paper presents on-wafer capacitance measurements of silicon-based RF MEMS capacitive switches down to frequencies below 1 Hz. The capacitance-voltage ( C-V ) curve measured at very-low frequency (0.01–10 Hz) deviates from the commonly measured
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f654cb50417a4e69876a9aef41639e63
https://doi.org/10.1109/jeds.2016.2602261
https://doi.org/10.1109/jeds.2016.2602261
Publikováno v:
GAMM-Mitteilungen. 36:161-185
The micro and sub-micro scale dimensions of the components of modern high-tech products pose challenging engineering problems that require advanced tools to tackle them. An example hereof is time dependent strain recovery, here referred to as anelast
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d0e2aa5b4d42ee25e31ba650ccc28d0
https://doi.org/10.1002/gamm.201310010
https://doi.org/10.1002/gamm.201310010
Publikováno v:
2016 International Conference on Microelectronic Test Structures (ICMTS), 10-14
STARTPAGE=10;ENDPAGE=14;TITLE=2016 International Conference on Microelectronic Test Structures (ICMTS)
STARTPAGE=10;ENDPAGE=14;TITLE=2016 International Conference on Microelectronic Test Structures (ICMTS)
In this article we compare three approaches to measure the spring constant in RF MEMS capacitive switches. We use the lowest vibration mode, as obtained from vibrometry; the pull-in voltage; and the low-field capacitance-voltage curve of the device t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::adf66d7d6c614f9fe337680d7c57ca88
https://doi.org/10.1109/icmts.2016.7476164
https://doi.org/10.1109/icmts.2016.7476164
Publikováno v:
Microelectronics International. 22:28-34
Purpose – In land grid array hybrid or system in package type products passive integration on silicon dies are flip chip mounted on a laminate substrate using Pb‐free solder. To increase the solder bump fatigue life, underfill is applied. The app
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fea7081fb28d5f7d5ebdd7ed42532627
https://doi.org/10.1108/13565360510593710
https://doi.org/10.1108/13565360510593710