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Autor:
Yunzhe Ma, Yi-Shin Yeh, Triveni S. Rane, Carlos Nieva, Jeremy Wahl, Surej Ravikumar, Guannan Liu, Jessica C. Chou, Sell Bernhard, Mark Armstrong, Saurabh Morarka, Vijaya B. Neeli, Mauricio Marulanda, Nathan Monroe, Said Rami, Hui Fu, Dyan Ali, L. Paulson, Hyung-Jin Lee, Sameer Joglekar, Thomas C. Brown, Jabeom Koo, Jeffrey Garrett, Ruonan Han, Qiang Yu, Georgios C. Dogiamis, Eric Karl, James Waldemer, Ying Zhang
Publikováno v:
2020 IEEE International Electron Devices Meeting (IEDM).
This paper presents the recent mmWave and sub-THz oriented technology developments as part of RF design-technology co-optimization (DTCO) efforts in Intel 22nm FinFET process (22FFL). Several back-end-of-line (BEOL) and front-end-of-line (FEOL) impro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8f2fc7a955450fb986a2df6a680fade
https://doi.org/10.1109/iedm13553.2020.9372105
https://doi.org/10.1109/iedm13553.2020.9372105
