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Effects of dry plasma releasing process parameters and induced in-plane stress on MEMS devices yield
Publikováno v:
SPIE Proceedings.
An investigation into the effects of dry plasma etching release process parameters, local wafer position and induced inplane stress on the yield of MEMS devices is presented. Several identical wafer quarters, each subjected to different releasing pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fef2b5b10e5dde45b1ea96e8d24f200
https://doi.org/10.1117/12.910854
https://doi.org/10.1117/12.910854
