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pro vyhledávání: '"Jeremy D. Russell"'
Autor:
Jeremy D Russell
Publikováno v:
Microscopy of Semiconducting Materials 2003 ISBN: 9781351074636
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e43b624cd0dd4b8ec6e1b42ad0b5a8e
https://doi.org/10.1201/9781351074636-116
https://doi.org/10.1201/9781351074636-116
Publikováno v:
Microelectronics Reliability. 50:1446-1450
The optimal parameters of electron beam induced carbon deposition (EBICD) using hydrocarbon contamination were studied as a function of electron beam energy and scanning time to avoid the mixing or damage layer formation at the interface of the elect
Publikováno v:
Microscopy and Microanalysis. 21:2075-2076
Publikováno v:
Microscopy and Microanalysis. 21:279-280
Autor:
Esther Chen, Jeremy D. Russell, Daniel Flatoff, Nicolas LaManque, Bianzhu Fu, Wayne Zhao, Stephen Mongeon
Publikováno v:
Microscopy and Microanalysis. 20:362-363
Introductions of 3-Dimentional FinFET transistors in semiconductor device open a new era for continuous shrinkage of semiconductor transistor nodes. One big challenge for physical failure analysis (PFA) and transmission electron microscopy (TEM) is t
Publikováno v:
Microscopy and Microanalysis. 20:1000-1001
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper provides details of a novel method developed to cover a tiny epoxy layer as an intermediate buffer on the site-specific surface defect using a micro-bush on the tip of a glass needle in a plucking system without sample surface damage and l
Publikováno v:
International Symposium for Testing and Failure Analysis.
One of the approaches to visualize dopant regions is to use SEM dopant contrast. In silicon, the technique is rather more problematical, presumedly because typical pn-junction built-in potentials are three times smaller. Dapor et al. have reviewed th
Publikováno v:
International Symposium for Testing and Failure Analysis.
Electron tomography includes four main steps: tomography data acquisition, image processing, 3D reconstruction, and visualization. After acquisition, tilt-series alignments are performed. Two methods are used to align the tilt-series: cross-correlati
Publikováno v:
International Symposium for Testing and Failure Analysis.
It is well known that pursuing the miniaturization of devices to lower the cost and increase high-speed performance are extremely important goals for dynamic random access memory (DRAM). Therefore, electron tomography has a high potential for applica