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Publikováno v:
Energies, Vol 12, Iss 19, p 3783 (2019)
This article describes a novel application of thermal anisotropy for improving the energy efficiency of building envelopes. The current work was inspired by existing research on improved heat dissipation in electronics using thermal anisotropy. Past
Externí odkaz:
https://doaj.org/article/e50498d5323744acbf18757000abd3df
Autor:
Meghan E. Lamm, Kai Li, Jerald Atchley, Som S. Shrestha, Shannon M. Mahurin, Diana Hun, Tolga Aytug
Publikováno v:
Polymer. 267:125652