Zobrazeno 1 - 10
of 48
pro vyhledávání: '"Jeong-Tak Oh"'
Autor:
Hiroshi Amano, Eunduk Lee, Jihyung Moon, Byoungjun Choi, Sang-Youl Lee, Tae Yeon Seong, Jeong-Tak Oh, Hwan-Hee Jeong
Publikováno v:
IEEE Photonics Technology Letters. 32:1041-1044
We investigated the effect of plasma-etching on the electrical and optical performance of lateral AlGaInP-based red micro-LEDs as a function of etching time, where plasma-etched Ag particles were used as masks. For the sample etched for 12 s, around
Autor:
Chung Song Kim, Sunwoo Park, Jeong-Tak Oh, Hwan-Hee Jeong, Tae Yeon Seong, Hiroshi Amano, Ji Hyung Moon, Sang-Youl Lee, Yong-Tae Moon
Publikováno v:
IEEE Photonics Technology Letters. 32:438-441
We investigated how the performance and reliability of AlGaInP-based red (620 nm) micro-light-emitting diodes (micro-LEDs) ( $25\times 17\,\,\mu \text{m}^{2}$ ) were influenced by the use of $n$ -AlInP ohmic layer and distributed Bragg reflector (DBR
Autor:
June O. Song, Hwan Hee Jeong, Hiroshi Amano, Ho Young Kim, Ki Seok Kim, Tae Yeon Seong, Lim Chang Man, Jeong Tak Oh
Publikováno v:
ECS Journal of Solid State Science and Technology. 8:Q165-Q170
We investigated the effect of via-holes in the lead-frame on the reliability of blue flip-chip light-emitting diodes (FCLEDs). For bonding, conventional Sn-Ag(3.0%)-Cu(0.5%) solder (SAC) and Ag sintered paste were adopted. Lateral LED, conventional F
Autor:
Jung Hun Jang, Jung Hyun Eum, Yong-Tae Moon, Youn Joon Sung, Jeong Tak Oh, Tae Yeon Seong, Sang Youl Lee, Jun O. Song
Publikováno v:
Journal of Alloys and Compounds. 732:630-636
A combined buffer layer growth process was developed to grow crack-free GaN layers on 8-inch Si(111) wafers and so light-emitting diodes (LEDs). The combined buffer layer consisted of 2 nm-thick low-temperature (LT, 850 °C)-AlN, 8 nm-thick graded-te
Autor:
Tae Yeon Seong, Sang Youl Lee, Jeong Tak Oh, Yoomin Jo, Kiman Kang, Doyub Kim, Hwan Hee Jeong, Se Yeon Jung, Eunduk Lee
Publikováno v:
ECS Journal of Solid State Science and Technology. 10:045003
We investigate the effects of pixel distance and light emitting diode (LED) thickness on the luminance distribution and contrast ratio of a 16 × 16 blue and white LED array for vehicle headlamp application. With increasing pixel distance from 10 to
Autor:
Woong Sun Yum, Hyunsoo Lim, Tae Yeon Seong, Hwan Hee Jeong, Sang Youl Lee, Jeong Tak Oh, Rak Jun Choi
Publikováno v:
ECS Journal of Solid State Science and Technology. 10:045002
We investigated the electrical and optical performance and reliability of 278 nm deep ultraviolet (DUV) AlGaN-based flip-chip light-emitting diodes (FCLEDs) fabricated with ITO/Al and reference Ni/Au contacts. The DUV FCLEDs with the Ni/Au and ITO/Al
Autor:
Ho Young Kim, Kyoung Mo Kang, Kwang Ho Park, Tae Yeon Seong, Young Min Moon, Jong Woo Lee, Hwan Hee Jeong, Jae Moon Lee, Jeong Tak Oh
Publikováno v:
ECS Journal of Solid State Science and Technology. 10:015004
We investigated the effect of different types of die attach adhesives on the performance and reliability of InGaN-based LED packages. At 260 °C, the average shear strength was 10.00 and 22.30 MPa for Ag epoxy and Ag sinter paste samples, respectivel
Autor:
Woong Sun Yum, Sang Youl Lee, Hwan Hee Jeong, Jeong Tak Oh, Su Jung Yoon, Myung Sub Kim, Tae Yeon Seong
Publikováno v:
ECS Journal of Solid State Science and Technology. 10:015001
We investigated the effect of the conducting substrate on the performance of GaAs-based VCSELs, where the substrates were 230 μm-GaAs (reference), 10 μm-GaAs/metal, and 0.5 μm-GaAs/metal. The VCSELs with the 10 μm- and 0.5 μm thick GaAs/metal-su
Autor:
Mojtaba Asadirad, June-o Song, Jeong Tak Oh, Shahab Shervin, Keon Hwa Lee, Seung Kyu Oh, Jae-Hyun Ryou, Yong-Tae Moon
Publikováno v:
IEEE Photonics Technology Letters. 28:1956-1959
Demonstrated are visible GaN-based light-emitting diodes (LEDs) on economical large-area Si substrates using an advanced device and packaging architecture to improve optical output power, while reducing manufacturing costs. The process employs thin-f
Autor:
Ho Young Kim, Hwan Hee Jeong, Yong Seon Song, Jeong Tak Oh, Kwang Ho Park, Min Su Kim, Tae Yeon Seong, Kwang Hee Lee
Publikováno v:
ECS Journal of Solid State Science and Technology. 9:065018
We investigated the effect of the surface roughness of the differently plated printed circuit board (PCB) on the reliability of AlGaInP-based LED packages. The electroless-plated PCB exhibited smoother surface than the electrolytic-plated one. Maximu