Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Jeong-Hoon Ahn"'
Publikováno v:
Frontiers in Pharmacology, Vol 13 (2022)
Background: Global pharmaceutical companies in Korea argue that the development of innovative drugs should be recognized as a social contribution, yet it has been countered by various stakeholders. The need to distinguish between philanthropic activi
Externí odkaz:
https://doaj.org/article/2b11e6b29a15463c93b55e0a6178f2eb
Autor:
Jeong hoon Ahn
Publikováno v:
Journal of Chinese Studies. 103:121-143
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92b15bd9b8ca80c2afbe02a1eda9f2a5
https://doi.org/10.35982/jcs.103.6
https://doi.org/10.35982/jcs.103.6
Autor:
Yang Zhang, Jeong Hoon Ahn
Publikováno v:
Journal of Chinese Studies. 100:191-217
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::09c5c68dbc47d9dfee14d9cbaf7d8459
https://doi.org/10.35982/jcs.100.10
https://doi.org/10.35982/jcs.100.10
Publikováno v:
Journal of Korean Medicine Rehabilitation. 32:105-121
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01699ff18ae79a432183498b35f11102
https://doi.org/10.18325/jkmr.2022.32.2.105
https://doi.org/10.18325/jkmr.2022.32.2.105
Autor:
Jungil Park, Yunki Choi, Jeong Hoon Ahn, Byung Je Jung, Hoyoun Lee, Jinho Kim, Eunyoung Park, Jaehyeong Park, Hyun-Ji Song, Miji Lee, Ja-Hum Ku
Publikováno v:
2022 IEEE International Interconnect Technology Conference (IITC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::406df53a50e1edc83f000c8eabacf78d
https://doi.org/10.1109/iitc52079.2022.9881283
https://doi.org/10.1109/iitc52079.2022.9881283
Publikováno v:
Journal of Korean Medicine Rehabilitation. 31:15-24
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::087476f8fe21d0b9fa1ebb56892d95ba
https://doi.org/10.18325/jkmr.2021.31.2.15
https://doi.org/10.18325/jkmr.2021.31.2.15
Publikováno v:
2021 IEEE International Interconnect Technology Conference (IITC).
This paper describes an advanced 5nm node back-end-of-line (BEOL) process integration based on an extreme ultraviolet (EUV) lithography process, atomic layer deposition (ALD) barrier metal (BM) and Cu reflow process. The ALD BM technology was integra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c680b3092675577e340b96bb9963781a
https://doi.org/10.1109/iitc51362.2021.9537371
https://doi.org/10.1109/iitc51362.2021.9537371
Autor:
Won Ji Park, Jae Hee Oh, Ji Hyung Kim, Seong Wook Moon, Jeong Hoon Ahn, Ding Shaofeng, Jung Ho Park, Won Hyoung Lee, Min Guk Kang, Choi Yun Ki, Seung Ki Nam, Je Gwan Hwang, Jong Mil Youn
Publikováno v:
2021 IEEE International Interconnect Technology Conference (IITC).
Interposer to interconnect between the electronic components has been developed for the last few decades because it can improve the system performance effectively, compared to the system with intra-chip wiring. In this paper, the integrated stack cap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::342c132f1ebe9f90373a841699094d8f
https://doi.org/10.1109/iitc51362.2021.9537342
https://doi.org/10.1109/iitc51362.2021.9537342
Autor:
Jong-Mil Youn, Kichang Sung, Ju-Heon Kim, Jeong-Hoon Ahn, Wonkyu Han, Junki Jang, Yun-Ki Choi, Woojin Jang, Hoon Kim, Chang-Hyun Kim, Hyunju Yim, Wonmo Kang, Rak-Hwan Kim, Youngju Lim, Young Soo Yoon, Dongwoo Shin
Publikováno v:
2021 IEEE International Interconnect Technology Conference (IITC).
We demonstrate that when a thin ALD (atomic layer deposition) TaN as a barrier metal is deposited to the Cu interconnect, the upper via resistance is significantly increased. We also exhibit that the abnormal upper via resistance is consistent with t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3001ed74dd45f03dcc568d479888c889
https://doi.org/10.1109/iitc51362.2021.9537395
https://doi.org/10.1109/iitc51362.2021.9537395
Autor:
Jeong Hoon Ahn, Min Guk Kang, Hyun Woo Tak, Jun Ki Jang, Ye Ji Shin, Jae Young Hyeon, Geun Young Yeom, Kyung Chae Yang
Publikováno v:
ECS Transactions. 89:79-86
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::922a0eb6c93b058e463762cb35a98fcd
https://doi.org/10.1149/08903.0079ecst
https://doi.org/10.1149/08903.0079ecst