Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Jeong-Gi Jin"'
Autor:
Dae-Woo Kim, Dan Oh, Joo-yeon Choi, Gyoungbum Kim, Jae-gwon Jang, Jeong-Gi Jin, Park Jungho, Jin-woo Park, Kyoung-lim Suk, Won-kyoung Choi, Su-chang Lee, Jeon Gwangjae, Lee Seokhyun
Publikováno v:
2020 International Wafer Level Packaging Conference (IWLPC).
As faster data processing and communication gets more demanded for Data Center/Cloud, HPC (High Performance Computing), AI (Artificial Intelligence) accelerator and Network markets, HBM (High Bandwidth Memory) becomes main memory type to meet the req
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2043ba2dcc218a9f7a12df6e5498cc60
https://doi.org/10.23919/iwlpc52010.2020.9375895
https://doi.org/10.23919/iwlpc52010.2020.9375895
Adhesion improvement of electroless plated Ni layer by ultrasonic agitation during zincating process
Publikováno v:
Thin Solid Films. 466:272-278
The adhesion of electroless plated Ni layers on Al/Si substrates has been investigated. The zincating treatment was conducted with both a conventional method and a modified method. In the modified method, an ultrasonic agitation was applied during zi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::70f213f86c8c637e54bac38deac13584
https://doi.org/10.1016/j.tsf.2004.02.100
https://doi.org/10.1016/j.tsf.2004.02.100
Publikováno v:
Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).
Solder bump whose pitch is 150-300 /spl mu/m was fabricated on Si substrate by electroplating with the medium thickness (/spl sim/30 /spl mu/m) photoresist. TiW/Cu/Cu mini bump was used as a UBM (under bump metallurgy) layer. TiW (0.3 /spl mu/m)/Cu (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::012454741efaeaf6904e0b913d2dc165
https://doi.org/10.1109/emap.2001.983978
https://doi.org/10.1109/emap.2001.983978
Publikováno v:
Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).
The nucleation and growth behavior of zinc particles deposited from the zincate solution on aluminum substrates were investigated. The zinc particles initially nucleated on the peak or edge of the aluminum surface which was exposed to the zincate sol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::29b113492265b693188bc024aba55b1c
https://doi.org/10.1109/emap.2001.983961
https://doi.org/10.1109/emap.2001.983961
Publikováno v:
Applied Physics Letters. 88:112107
The memory effects of ZnO nanoparticles embedded in a polyimide (PI) matrix were investigated. Transmission electron microscopy images and selected area electron diffraction patterns showed that ZnO nanocrystals were created inside the PI layer. Capa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2df8ee677ef5fd92a27261be336ac7d
https://doi.org/10.1063/1.2185615
https://doi.org/10.1063/1.2185615
Autor:
J. H. Jung, Joon-Kuk Kim, Tae Whan Kim, In Mook Lee, Jeong-Gi Jin, Young Ho Kim, Chong Seung Yoon, Sung K. Lim
Publikováno v:
Applied Physics Letters. 86:032904
Self-assembled Ni1−xFex nanoparticles embedded in a polyimide (PI) matrix were formed by curing Ni1−xFex thin films with PI precursor layers. Transmission electron microscopy images and selected area electron-diffraction patterns showed that Ni1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::844440e0dee40960455ced2cb2733295
https://doi.org/10.1063/1.1850194
https://doi.org/10.1063/1.1850194
Publikováno v:
Advances in Electronic Materials & Packaging 2001 (Cat. No.01EX506); 2001, p170-177, 8p
Publikováno v:
Advances in Electronic Materials & Packaging 2001 (Cat. No.01EX506); 2001, p73-78, 6p