Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Jeong Hoon Moon"'
Publikováno v:
IEEE Access, Vol 9, Pp 99374-99387 (2021)
For synchronization between the grid voltage and generator voltage, we propose a phase-locked loop (PLL) algorithm with virtual rotational reference frame and feed-forward compensation. It is possible to accurately estimate the phase angle through a
Externí odkaz:
https://doaj.org/article/fb84d6a0f38841339a120a9105afcaf1
Publikováno v:
Journal of Electronic Materials. 47:4165-4169
The effect of thermal shock on the mechanical reliability of epoxy Sn-58wt.%Bi composite (epoxy Sn-58wt.%Bi) solder joints was investigated with different surface-finished substrates. Sn-58wt.%Bi-based solder has been considered as a promising candid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1dc689f4685cdcc0daa6c7163f190e87
https://doi.org/10.1007/s11664-018-6224-7
https://doi.org/10.1007/s11664-018-6224-7
Publikováno v:
Nanoscience and Nanotechnology Letters. 9:1190-1194
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9db577081a32077182a1c382165f687e
https://doi.org/10.1166/nnl.2017.2468
https://doi.org/10.1166/nnl.2017.2468
Publikováno v:
Electrochimica Acta. 111:261-267
To fabricate flexible dye-sensitized solar cells (DSCs) utilizing full solar spectrum, the double-layered TiO 2 films, selectively loading two different dyes in discrete layers, were formed on a plastic substrate by transferring the high-temperature-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a002cd032c43b155976ab2e4166dbe7
https://doi.org/10.1016/j.electacta.2013.08.081
https://doi.org/10.1016/j.electacta.2013.08.081
Autor:
Jong-Bum Lee, Ja-Myeong Koo, Jong-Min Kim, Jeong-Hoon Moon, Sung-Ho Jeon, Jong-Gun Lee, Jung-Lae Jo, Seung-Boo Jung
Publikováno v:
Journal of the Korean Physical Society. 54:1334-1338
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7785a2394a37a409e437208e0dc2da54
https://doi.org/10.3938/jkps.54.1334
https://doi.org/10.3938/jkps.54.1334
Autor:
Jong-Woong Kim, Ja-Myeong Koo, Daeup Kim, Yu-Na Kim, Seung-Boo Jung, Jong-Bum Lee, Jung-Lae Jo, Bo-In Noh, Jeong-Hoon Moon
Publikováno v:
Japanese Journal of Applied Physics. 47:4309-4313
This study was focused on the effect of atmospheric pressure plasma treatment conditions on the ultrasonic bonding properties of Au flip-chip bumps on Au-finished glass substrates. The spreading test of de-ionized (DI) water was carried out on the su
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4984ecd8cfc97a5472f1900f368325e8
https://doi.org/10.1143/jjap.47.4309
https://doi.org/10.1143/jjap.47.4309
Autor:
Ja-Myeong Koo, Jong-Woong Kim, Bo-In Noh, Sang-Su Ha, Sung-Ho Won, Seung-Boo Jung, Jeong-Hoon Moon, Jong-Bum Lee
Publikováno v:
Journal of the Korean Welding and Joining Society. 26:37-42
최근 전자 제품에 대한 가치 및 평가 기준이 변화하고 있다. 소비자들의 선택의 기준에 있어서 제품의 가격과 성능뿐만 아니라, 고장 없이 오랫동안 사용할 수 있는 제품, 즉 신뢰성이 높은
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52a692eecfb1547c7c88f396cc30fffd
https://doi.org/10.5781/kwjs.2008.26.2.037
https://doi.org/10.5781/kwjs.2008.26.2.037
Autor:
Chang-Yong Lee, Jeong-Hoon Moon, Seung-Boo Jung, Ja-Myeong Koo, Jeong-Won Yoon, Jong-Woong Kim, Choong-Don Yoo, Bo-In Noh
Publikováno v:
Journal of the Korean Welding and Joining Society. 26:31-36
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::126c948e1cc6b40ec478fe59c2929c3c
https://doi.org/10.5781/kwjs.2008.26.1.031
https://doi.org/10.5781/kwjs.2008.26.1.031
Autor:
Jong-Woong Kim, Daeup Kim, Jong-Bum Lee, Yu-Na Kim, Ja-Myeong Koo, Seung-Boo Jung, Jeong-Hoon Moon, Bui Quoc Vu
Publikováno v:
Journal of Electronic Materials. 37:118-124
The microstructural evolution, die shear strength, and electrical resistivity of Cu/Sn-3.5Ag (wt.%)/Cu ball grid array (BGA) solder joints were investigated after 1 to 10 reflows using scanning electron microscopy (SEM), transmission electron microsc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a1177bcaa281255c5e3291a42e0d029
https://doi.org/10.1007/s11664-007-0301-7
https://doi.org/10.1007/s11664-007-0301-7
Autor:
Jeong-Won Yoon, Jong-Woong Kim, Won-Chul Moon, Seung-Boo Jung, Bo-In Noh, Ja-Myeong Koo, Sang-Su Ha, Jeong-Hoon Moon
Publikováno v:
Journal of the Korean Welding and Joining Society. 25:6-15
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b125419b5ae0b250b1a8f038c84a609c
https://doi.org/10.5781/kwjs.2007.25.2.006
https://doi.org/10.5781/kwjs.2007.25.2.006