Effects of fluorocarbon polymer deposition on the selective etching of SiO2/photoresist in high density plasma.

Autor: Chu, Changwoong, Ahn, Taehyuk, Kim, Jisoo, Jeong, Sangsup, Moon, Jootae

Publikováno v: Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; 2000, Vol. 18 Issue 6, p2763-2768, 6p

Isolation Trench Etch Process Using Pulsed RF Bias Power in HBr/CF4/O2 Plasma

Autor: Park, Inho, Seung, Yung, Jeong, SangSup, Woo, Seok

Publikováno v: ECS Transactions; October 2011, Vol. 35 Issue: 20 p1-5, 5p