Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Jens Uwe Bruch"'
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XVIII.
Tapered resist profiles have been found to cause a deterimental effect on the overlay measurement capability, affecting lithography processes which utilize thick implant resist. Particularly, for resist thicknesses greater than 1.5 μm, the systemati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7bb071464005cb45afd94e5e47acebf
https://doi.org/10.1117/12.532334
https://doi.org/10.1117/12.532334
Autor:
Markus Veldkamp, Jens Uwe Bruch, Katrin Palitzsch, Uwe Schroeder, Dieter Nees, Ralf Schuster, Wolfram Koestler, Sirko Kramp, Tobias Mono
Publikováno v:
SPIE Proceedings.
Generally, the potential impact of systematical overlay errors on 300mm wafers is much larger than on 200mm wafers. Process problems which are merely identified as minor edge yield detractors on 200mm wafers, can evolve as major roadblocks for 300mm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9dd8839418ee070d30d58f87b02062bb
https://doi.org/10.1117/12.485019
https://doi.org/10.1117/12.485019