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pro vyhledávání: '"Jens Kruggel"'
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Induction soldering is a widely used process for the interconnection of construction parts. This technology allows a local heating process without putting the whole module into the oven, which minimizes the thermal load and thus improves the reliabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8d9728e9727c1a846db16f1eda0ede7
https://doi.org/10.23919/empc53418.2021.9584988
https://doi.org/10.23919/empc53418.2021.9584988
