Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Jens Beyersdorfer"'
Autor:
Marc Sentis, Jens Beyersdorfer, Laurens F. Tz. Kwakman, Jan Schischka, Falk Naumann, Marcus Straw, Frank Altmann, Gaëlle Coustillier
Publikováno v:
Scopus-Elsevier
In this paper different sample preparation strategies for fast and efficient failure analysis of 3D devices are reviewed and further explored. It will be shown that a combined workflow using laser ablation and plasma FIB milling provides best flexibi
Autor:
Jens Beyersdorfer, Jochen Kraft, C. Schmidt, Frank Altmann, Michél Simon-Najasek, Franz Schrank, Christian Große
Publikováno v:
International Symposium for Testing and Failure Analysis.
In this paper different methods and novel tools for failure localisation and high resolution material analysis for open TSV interconnects will be discussed. The paper shows the application of enhanced methods for the localisation of sidewall shorts i
Autor:
Christian Patzig, Jens Beyersdorfer, Joerg Siegert, Franz Schrank, Matthias Petzold, Viorel Dragoi, Jan-Paul Krugers, Peter Czurratis, Sebastian Brand
Publikováno v:
12th International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications-ECS Fall 2012 Meeting, 7 October 2012 through 12 October 2012, Honolulu, HI, 7, 50, 227-239
In this paper, a brief summary of potential defect formation and failure characteristics for low temperature plasma-assisted Si wafer bonding in correlation to different influencing factors is given. In terms of a failure catalogue classification, th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::87cbab5b9b04a365b00d42c7905576f6
http://resolver.tudelft.nl/uuid:9f249e39-4efe-422e-b32d-a57d876733c4
http://resolver.tudelft.nl/uuid:9f249e39-4efe-422e-b32d-a57d876733c4