Zobrazeno 1 - 10
of 59
pro vyhledávání: '"Jennie S. Hwang"'
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 16:13-20
The “head-in-pillow” (HnP) defects in lead-free solder joint interconnections of Integrated Circuit (IC) packages with conventional (small) standoff heights of the solder joints, and particularly in packages with fine pitches, are attributed by m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93b7863e8aa42c83ef449e0b52a26809
https://doi.org/10.4071/imaps.735566
https://doi.org/10.4071/imaps.735566
Publikováno v:
International Symposium on Microelectronics. 2018:000534-000542
The “head-in-pillow” (HnP) defects in lead-free solder joint interconnections of IC packages with conventional (small) stand-off heights of the solder joints, and particularly in packages with fine pitches, are attributed by many electronic mater
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63f84adb0a8b5a5ac509de59ef83ed88
https://doi.org/10.4071/2380-4505-2018.1.000534
https://doi.org/10.4071/2380-4505-2018.1.000534
Publikováno v:
Soldering & Surface Mount Technology. 13:7-13
With the established surface mount infrastructure and the temperature constraints of components and printed circuit boards, the melting temperatures of lead‐free solder alloys need to be designed as close to 63Sn/37Pb as practical, and not to excee
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6c0dd778b6744fa27ddd0a1c406dd2d
https://doi.org/10.1108/09540910110385194
https://doi.org/10.1108/09540910110385194
Autor:
Jennie S. Hwang
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components
Autor:
Jennie S. Hwang
Publikováno v:
Handbook of Fine Pitch Surface Mount Technology ISBN: 9781468414394
Handbook of Fine Pitch Surface Mount Technology
Handbook of Fine Pitch Surface Mount Technology
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e216e152820d6676529d9ddc18c999c2
https://doi.org/10.1007/978-1-4684-1437-0_5
https://doi.org/10.1007/978-1-4684-1437-0_5
Autor:
Jennie S. Hwang
Publikováno v:
Solder Paste in Electronics Packaging ISBN: 9780442013530
Solder Paste in Electronics Packaging ISBN: 9789401160520
Solder Paste in Electronics Packaging ISBN: 9789401160520
Regarding chemical and physical characteristics of solder paste, the coverage in certain areas is inevitably discussed in general terms in order to avoid proprietary information.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e029a968bdf02f0fa4eaeb42b6cbb9fa
https://doi.org/10.1007/978-1-4615-3528-7_3
https://doi.org/10.1007/978-1-4615-3528-7_3
Autor:
Jennie S. Hwang
Publikováno v:
Solder Paste in Electronics Packaging ISBN: 9780442013530
Solder Paste in Electronics Packaging ISBN: 9789401160520
Solder Paste in Electronics Packaging ISBN: 9789401160520
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0ce581e1794ac06c8f0033dbf4cb3cb2
https://doi.org/10.1007/978-1-4615-3528-7_12
https://doi.org/10.1007/978-1-4615-3528-7_12
Autor:
Jennie S. Hwang
Publikováno v:
Solder Paste in Electronics Packaging ISBN: 9780442013530
The previous chapters have discussed the technology and scientific principles behind the major aspects of solder paste technology and applications. This chapter is to condense the common concerns and problems encountered by using solder paste one by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fc89e6af369cac29c72efbfa21f4361
https://doi.org/10.1007/978-1-4615-3528-7_10
https://doi.org/10.1007/978-1-4615-3528-7_10
Autor:
Jennie S. Hwang
Publikováno v:
Solder Paste in Electronics Packaging ISBN: 9780442013530
Solder Paste in Electronics Packaging ISBN: 9789401160520
Solder Paste in Electronics Packaging ISBN: 9789401160520
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9f17e28f2b1842c613673009dfabf779
https://doi.org/10.1007/978-1-4615-3528-7_7
https://doi.org/10.1007/978-1-4615-3528-7_7
Autor:
Jennie S. Hwang
Publikováno v:
Solder Paste in Electronics Packaging ISBN: 9780442013530
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b38da195956897a1f1bb0b4a5b6733eb
https://doi.org/10.1007/978-1-4615-3528-7_1
https://doi.org/10.1007/978-1-4615-3528-7_1