Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Jeng-Dar Ko"'
Autor:
Yu-Hua Chen, Hsiang-Hung Chang, Ying-Ching Shih, Shu-Ming Chang, Tzu-Ying Kuo, Wei-Chung Lo, Jeng-Dar Ko
Publikováno v:
2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).
The paper describes the newly development technology of 3D stacking packaging by introducing laser-drilled through silicon interconnect (LTSI). Compared to the recently abundant researches of 3D chip-to-wafer or wafer-to-wafer stacking, it demonstrat
Publikováno v:
56th Electronic Components and Technology Conference 2006.
Abundant three-dimensional packaging technologies were developed for chip-to-wafer or wafer-to-wafer bonding, which employed through silicon interconnect to achieve the shortest circuit design of inter-chip or inter-wafer. In this paper, we focused o
Autor:
Fang-Jun Leu, Yu-Chih Chen, Chien-Wei Chien, Yu-Hua Chen, Hsu-Tien Hu, Jeng-Dar Ko, Wei-Chung Lo, Tzu-Ying Kuo, Wun-Yan Chen
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
With the economic criteria and efficiency concern increasing, abundant through-hole vertical interconnections are playing the more and more important role in this area. The properties and characterization of through-hole vertical interconnects are th
Autor:
Kuo-Ning Chiang, Kuo-Chuan Chen, Chiao-Yun Chang, Shu-Ming Chang, Yu-Jiau Hwang, Li-Cheng Shen, Hsu-Tien Hu, Yu-Fang Chen, Jeng-Dar Ko, Chin-Yuan Cheng
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
Wafer level chip scale packaging (WLCSP) has some advantages, such as real die size packaging, high electrical performance and low manufacturing cost. However, because the mechanical reliability of a large die can not be guaranteed due to the CTE (co
Autor:
Shu-Ming Chang, Chin-Yuan Cheng, Li-Cheng Shen, Yu-Jiau Hwang, Yu-Fang Chen, Jeng-Dar Ko, Hsu-Tien Hu, Kuo-Chuan Chen, Chiao-Yun Chang, Kuo-Ning Chiang
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971); 2004, p7-12, 6p
Autor:
Wei-Chung Lo, Shu-Ming Chang, Yu-Hua Chen, Jeng-Dar Ko, Tzu-Ying Kuo, Hsiang-Hung Chang, Ying-Ching Shih
Publikováno v:
2007 International Symposium on VLSI Technology, Systems & Applications (VLSI-TSA); 2007, p1-2, 2p
Publikováno v:
56th Electronic Components & Technology Conference 2006; 2006, p6-6, 1p
Autor:
Wei-Chung Lo, Yu-Hua Chen, Jeng-Dar Ko, Tzu-Ying Kuo, Chien-Wei Chien, Yu-Chih Chen, Wun-Yan Chen, Fang-Jun Leu, Hsu-Tien Hu
Publikováno v:
Proceedings Electronic Components & Technology, 2005. ECTC '05; 2005, p337-337, 1p