Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Jen-Hsiang Liu"'
Autor:
Jen-Hsiang Liu, 劉仁翔
106
Taking the advantages of low sintering temperature and high processing flexibility, Ag nanoparticles have been widely used to fabricate interconnections and joints. With proper ingredients and processing designs, the sintering temperature ca
Taking the advantages of low sintering temperature and high processing flexibility, Ag nanoparticles have been widely used to fabricate interconnections and joints. With proper ingredients and processing designs, the sintering temperature ca
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/58hx4q
Autor:
Jen-Hsiang Liu, Jenn-Ming Song, Wei-Chen Huang, Chin-Huang Chang, Chi-Lin Huang, Lung-Tang Hung, Shih-Chieh Chao, Po-Yen Shen
Publikováno v:
Microelectronics Reliability. 99:161-167
This study investigates surface oxidized layers of Cu-Fe-Zn-P (C194) and Cu-Ni-Si-Mg (C7025) lead frames under different oxidation conditions and their influence on the adhesion of epoxy molding compounds with lead frames. Micro-etching and electropl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a0c1e5901ff25c21b8e3218ee61712f
https://doi.org/10.1016/j.microrel.2019.05.020
https://doi.org/10.1016/j.microrel.2019.05.020
Publikováno v:
Journal of Electronic Materials. 46:5150-5157
Ultra-thin electrodeposited Cu foils have been developed for substrate thinning for mobile devices. Considering the corrosion by residual etchants from the lithography process for high-density circuit wiring, this study investigates the microstructur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04d9943cf5cedbce56d5cb5226b786ee
https://doi.org/10.1007/s11664-017-5517-6
https://doi.org/10.1007/s11664-017-5517-6
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
Taking the advantage of low sintering temperature and high processing flexibility, Ag nanoparticles have been widely used to fabricate interconnections and joints. This report studies the preferred orientation of the sintered nanoparticles and electr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eaf290c8446823e99fc9935cdb6202ea
https://doi.org/10.23919/icep.2019.8733413
https://doi.org/10.23919/icep.2019.8733413
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
In this study, newly developed Cu-Ag composite pastes consisted of Ag nanoparticles, Ag submicron particles and copper formate were adopted for low-temperature low-pressure bonding. Joints between the substrates of Cu, Ni/Au, and Ag finishes can be w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad5cccc65f4156440e6c9dd6f4d3de9d
https://doi.org/10.23919/icep.2018.8374335
https://doi.org/10.23919/icep.2018.8374335
Publikováno v:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
It has been proposed that Cu-Ag alloys exhibit longer eletromigration life time than Cu as well as superior electrochemical migration resistance than Ag. Our group developed a new kind of Cu-Ag composite paste which is capable of achieving bonding at
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9dc410a70124e82e0b039ce99d4034f9
https://doi.org/10.23919/ltb-3d.2017.7947429
https://doi.org/10.23919/ltb-3d.2017.7947429
Autor:
Jose Fernando Caceres, Shyy Woei Chang, Jen Hsiang Liu, Yun Ting Huang, Min-Fu Hsieh, P.-S. Wu, W.L. Cai
Publikováno v:
Inventions
Volume 4
Issue 4
Volume 4
Issue 4
Keywords: spirally twisted channel flow
thermal management electric motor
thermal management electric motor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0bd20db014b9a0ac005e529fda52140c
https://doi.org/10.3390/inventions4040069
https://doi.org/10.3390/inventions4040069