Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Jeffrey H. Baker"'
Publikováno v:
Primary care. 45(3)
Complementary and alternative medicine (CAM) is increasingly being used in Western countries despite the lack of conclusive research studies. Several CAM modalities have only shown variable therapeutic efficacy in infectious disease management. Clini
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::10dba67cbc887565c9ae743054ef83d0
https://pubmed.ncbi.nlm.nih.gov/30115339
https://pubmed.ncbi.nlm.nih.gov/30115339
Autor:
Neha Singh, Steven M. Smith, T. E. Tiwald, James N. Hilfiker, Diana Convey, Jeffrey H. Baker, Harland G. Tompkins
Publikováno v:
Thin Solid Films. 516:7979-7989
Spectroscopic Ellipsometry (SE) is routinely used to measure thickness and optical constants of dielectric and semiconductor films. However, unique results for thin absorbing films, such as metals, are difficult to ensure. SE enables simultaneous det
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5fb244a4ecec1148209191bb04dfd3e
https://doi.org/10.1016/j.tsf.2008.04.060
https://doi.org/10.1016/j.tsf.2008.04.060
Autor:
Ngoc V. Le, William J. Dauksher, Pawitter J. S. Mangat, Jeffrey H. Baker, K. Gehoski, Kevin J. Nordquist, Diana Convey, S. R. Young, Eric S. Ainley
Publikováno v:
Microelectronic Engineering. 83:929-932
Nano-imprint lithography is attracting attention as a low cost method for printing nanometer-scale geometries and has obtained placement on the International Technology Roadmap for Semiconductors as a potential lithography solution at the 32 and 22nm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36822007c179413571d91bf524c4636f
https://doi.org/10.1016/j.mee.2006.01.075
https://doi.org/10.1016/j.mee.2006.01.075
Autor:
David P. Mancini, Todd Bailey, Kevin J. Nordquist, K. Gehoski, John G. Ekerdt, Sidlgata V. Sreenivasan, Andy E. Hooper, Jeffrey H. Baker, L. Dues, William J. Dauksher, D. J. Resnick, S. Johnson, Carlton G Willson
Publikováno v:
Microelectronic Engineering. :221-228
Step and flash imprint lithography (SFIL) replicates patterns by using a transparent template with relief images etched into its surface. Recent work has examined alternative methods for template fabrication. One scheme incorporates a conductive and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41f00df00ab66db40f241848d67afd96
https://doi.org/10.1016/s0167-9317(03)00075-3
https://doi.org/10.1016/s0167-9317(03)00075-3
Autor:
K. Gehoski, M. Meissl, William J. Dauksher, D. J. Resnick, Sidlgata V. Sreenivasan, Eric S. Ainley, Matthew E. Colburn, Jeffrey H. Baker, Byung Jin Choi, David P. Mancini, Kevin J. Nordquist, John G. Ekerdt, Todd Bailey, Carlton G Willson, A. Alec Talin, S. Johnson
Publikováno v:
Microelectronic Engineering. :461-467
Step and flash imprint lithography (SFIL) is an attractive method for printing sub-100 nm geometries. Relative to other imprinting processes, SFIL has the advantage that the template is transparent, thereby facilitating conventional overlay technique
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4fec9cc2beffe5dd4280a7a15270638a
https://doi.org/10.1016/s0167-9317(02)00462-8
https://doi.org/10.1016/s0167-9317(02)00462-8
Publikováno v:
Surface and Interface Analysis. 29:227-231
In this study, we show that the optical constants of sputter-deposited chromium depend on the argon pressure used for the deposition. Higher argon pressure gives lower extinction coefficients. Sheet resistance measurements show that those materials w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52d84454941ab1b6a0d08f6576e02185
https://doi.org/10.1002/(sici)1096-9918(200003)29:3<227::aid-sia730>3.0.co
https://doi.org/10.1002/(sici)1096-9918(200003)29:3<227::aid-sia730>3.0.co
Publikováno v:
SPIE Proceedings.
In this paper we describe a method of fabricating a Fabry-Perot filter array consisting of four distinct wavelengths using a stopping layer, which in turn is discriminately measured. Precise control of the oxide thickness is demonstrated by using ref
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b1fa4450edde4713b02637145bea780
https://doi.org/10.1117/12.684937
https://doi.org/10.1117/12.684937
Autor:
Laura Dues, Jeffrey H. Baker, D. J. Resnick, William J. Dauksher, Kathleen A. Gehoski, Ngoc V. Le
Publikováno v:
SPIE Proceedings.
Along with other Next Generation Lithography (NGL) methods, imprint lithography has been included on the International Roadmap for Semiconductors (ITRS) for the 32 nm node, predicted to be production-ready by 20131. Step and Flash Imprint Lithography
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ba8da0a3d23e891a2df8ad9289382ba
https://doi.org/10.1117/12.605932
https://doi.org/10.1117/12.605932
Publikováno v:
2000 Digest of the LEOS Summer Topical Meetings. Electronic-Enhanced Optics. Optical Sensing in Semiconductor Manufacturing. Electro-Optics in Space. Broadband Optical Networks (Cat. No.00TH8497).
We discuss how analytical tools in a characterization lab can be used to enhance metrology tools in a fab. The emphasis is on the interaction between a characterization lab and a wafer fab belonging to the same industrial company. Specifically this w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07733fb20981f91a603b72c20572d074
https://doi.org/10.1109/leosst.2000.869717
https://doi.org/10.1109/leosst.2000.869717
Autor:
William J. Dauksher, J. S. Reid, J. A. Chan, Jeffrey H. Baker, Kevin Cummings, D. J. Resnick, Rich Gregory, N. D. Theodore, W. A. Johnson, M.‐A. Nicolet, C. J. Mogab
X‐ray masks have been fabricated by depositing a compressively stressed refractory material on a wafer, annealing to a zero stress state, and then forming the membrane. Amorphous TaSiN and TaSi alloys deposited with a magnetron sputter tool have be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::918653686cab4b536ab81ed6d0aee934
https://resolver.caltech.edu/CaltechAUTHORS:20120216-095821404
https://resolver.caltech.edu/CaltechAUTHORS:20120216-095821404
