Zobrazeno 1 - 10
of 37
pro vyhledávání: '"Jeffrey Ewanchuk"'
Autor:
Baljit Riar, Jeffrey Ewanchuk, Hailing Wu, Yue Zhang, Xiao Li, Dihao Ma, Rob Borjas, Jin Wang
Publikováno v:
2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01e830b2231ffd7e83bdd025308ecd28
https://doi.org/10.1109/wipda56483.2022.9955276
https://doi.org/10.1109/wipda56483.2022.9955276
Publikováno v:
IEEE Transactions on Power Electronics. 36:898-910
Due to practical limitations in the manufacturing of power semiconductor dies, high power modules are composed of several dies in parallel in order to meet the desired load current requirements. With careful attention to the design, modern insulated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c9996d0732bd647185fc0ae478e0ead
https://doi.org/10.1109/tpel.2020.3002188
https://doi.org/10.1109/tpel.2020.3002188
Autor:
Zoubir Khatir, Ali Ibrahim, Son-Ha Tran, Richard Lallemand, Stefan Mollov, Jean-Pierre Ousten, Jeffrey Ewanchuk
Publikováno v:
IEEE Transactions on Power Electronics. 34:2171-2180
The study of the impact of junction temperature swings (Δ Tj ) on degradation mechanisms during power cycling tests (PCTs) requires both a control of the applied thermal stress and a separation of degradation modes. The first requirement can be obta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04a5636d3a12a5b047b848469c46a413
https://doi.org/10.1109/tpel.2018.2847234
https://doi.org/10.1109/tpel.2018.2847234
Autor:
Bart Antonie van Hassel, Russell Taylor, Jeffrey Ewanchuk, Charles E. Lents, Suman Dwari, Parag Kshirsagar, Jonathan M. Rheaume
Publikováno v:
AIAA Propulsion and Energy 2020 Forum.
Development of electric, hybrid and turboelectric propulsion technologies for electrified aircraft propulsion system is essential for improving fuel consumption, reducing emissions and noise pollution, lowering maintenance costs and improving reliabi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fbf13ef0d284a0d4f30e59366459d666
https://doi.org/10.2514/6.2020-3581
https://doi.org/10.2514/6.2020-3581
Publikováno v:
Microelectronics Reliability. :428-432
Typical high-current power modules used in traction and wind generation contain several dies in parallel. Non-ideal geometries and electrical parameter variations cause an unequal aging of each die which limits the effectiveness of using parallel dev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1282eaa052f908e40b3c019d200a13df
https://doi.org/10.1016/j.microrel.2018.07.034
https://doi.org/10.1016/j.microrel.2018.07.034
Autor:
Jeffrey Ewanchuk, Guillaume Regnat, David Frey, Jean-Paul Ferrieux, Pierre-Olivier Jeannin, Stefan Mollov
Publikováno v:
IEEE Transactions on Industry Applications. 54:1634-1644
A new 3-D power module dedicated to SiC mosfet is presented. It is based on printed circuit board embedded die technology and is compared with a standard power module. After considering the characteristics that contribute to optimal switching perform
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16552611de31209f01f3a0c992500ba0
https://doi.org/10.1109/tia.2017.2784802
https://doi.org/10.1109/tia.2017.2784802
Autor:
Nausicaa Dornic, Son Ha Tran, Richard Lallemand, Ali Ibrahim, Zoubir Khatir, Jean-Pierre Ousten, Stefan Mollov, Jeffrey Ewanchuk
Publikováno v:
IEEE Journal of Emerging and Selected Topics in Power Electronics
IEEE Journal of Emerging and Selected Topics in Power Electronics, Institute of Electrical and Electronics Engineers, 2019, 8 p. ⟨10.1109/JESTPE.2019.2918941⟩
IEEE Journal of Emerging and Selected Topics in Power Electronics, Institute of Electrical and Electronics Engineers, 2019, 8 p. ⟨10.1109/JESTPE.2019.2918941⟩
In this paper, a lifetime model for bond wire contacts of insulated gate bipolar transistors (IGBT) power modules is reported. This model is based on power cycling tests obtained under accelerated conditions, and a finite-element model taking into ac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::61f7977e47c6c04fafbdb463e7c0ea15
https://hal.archives-ouvertes.fr/hal-02186162
https://hal.archives-ouvertes.fr/hal-02186162
Publikováno v:
2018 IEEE Energy Conversion Congress and Exposition (ECCE).
The current sharing in a high current power module can have a dramatic impact on the total current handling capability of that power module. Hence, in an effort to improve the utilization of the individual dies within a power module, this paper explo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7c68c6848280cb8b6e3890f53697d68
https://doi.org/10.1109/ecce.2018.8557880
https://doi.org/10.1109/ecce.2018.8557880
Autor:
Ali Ibrahim, Zoubir Khatir, Nausicaa Dornic, Stefan Mollov, Jean-Pierre Ousten, Jeffrey Ewanchuk, Son-Ha Tran
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2018, 88, p. 462-469. ⟨10.1016/j.microrel.2018.07.041⟩
Microelectronics Reliability, Elsevier, 2018, 88, p. 462-469. ⟨10.1016/j.microrel.2018.07.041⟩
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2018, AALBORG, DANEMARK, 01-/10/2018 - 05/10/2018; This paper presents an experimental technique to characterize the damage evolution of the topside inter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e61e9ff16b550871340d77f1eef396ab
https://hal.archives-ouvertes.fr/hal-02090201/file/tex00000768.pdf
https://hal.archives-ouvertes.fr/hal-02090201/file/tex00000768.pdf
Autor:
Guillaume Regnat, Pierre-Olivier Jeannin, David Frey, Stefan Mollov, Jeffrey Ewanchuk, Jean-Paul Ferrieux
Publikováno v:
IEEE Transactions on Industry Applications
IEEE Transactions on Industry Applications, Institute of Electrical and Electronics Engineers, 2018, 54 (2), pp.1634--1644. ⟨10.1109/TIA.2017.2784802⟩
Energy Conversion Congress & Exposition (ECCE 2016)
Energy Conversion Congress & Exposition (ECCE 2016), Sep 2016, Milwaukee, United States
IEEE Transactions on Industry Applications, Institute of Electrical and Electronics Engineers, 2018, 54 (2), pp.1634--1644. ⟨10.1109/TIA.2017.2784802⟩
Energy Conversion Congress & Exposition (ECCE 2016)
Energy Conversion Congress & Exposition (ECCE 2016), Sep 2016, Milwaukee, United States
An Integrated Power Board technology was used to construct a 3D power module. This packaging is suitable for use of WBG devices as it reduces the inductive parasitics to the strict minimum, with a 2nH loop inductance in our 1.2kV/80A SiC prototype us
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7f971c5a1a8ec309a07a0bf65d2c59f6
https://hal.archives-ouvertes.fr/hal-02278145
https://hal.archives-ouvertes.fr/hal-02278145