Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Jeffrey Demmin"'
Publikováno v:
International Symposium on Microelectronics. 2018:000246-000251
DARPA is leading a new thrust to leverage mainstream semiconductor design approaches to enable the rapid and cost-effective integration of heterogeneous device technologies. This represents a leap ahead beyond the monolithic silicon approach that has
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::527063e58e230fcfdccc89284909e0d6
https://doi.org/10.4071/2380-4505-2018.1.000246
https://doi.org/10.4071/2380-4505-2018.1.000246
Publikováno v:
IEEE Microwave Magazine. 18:44-59
The Microsystems Technology Office of the U.S. Defense Advanced Research Projects Agency (DARPA) is developing revolutionary materials, devices, and integration techniques to meet the performance requirements for advanced microwave and millimeter-wav
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15636cf3ed09ba62be91083a56690914
https://doi.org/10.1109/mmm.2016.2635811
https://doi.org/10.1109/mmm.2016.2635811
Publikováno v:
3DIC
The DARPA Microsystems Technology Office is developing revolutionary materials, devices, and integration techniques for meeting the performance requirements for advanced microwave and RF systems. The DARPA Compound Semiconductor Materials on Silicon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10b6ded0aacc05e82cfdd2eb7510d33d
https://doi.org/10.1109/3dic.2015.7334469
https://doi.org/10.1109/3dic.2015.7334469
Publikováno v:
Unattended Ground Sensor Technologies and Applications VII.
Demands for miniaturized networked sensors that can be deployed in large quantities dictate that the packages be small and cost effective. In order to accomplish these objectives, system developers generally apply advanced packaging techniques to pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::434e8d8850bac601a45b6e6fcfb06226
https://doi.org/10.1117/12.603614
https://doi.org/10.1117/12.603614
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