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pro vyhledávání: '"Jeffrey D. Birdsley"'
Autor:
M. Bruce, V. Bruce, Nicholas Antoniou, Jeffrey D. Birdsley, Rama R. Goruganthu, M.A. Thompson, R. Ring, Glen Gilfeather, Jesse A. Salen
Publikováno v:
1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).
Design debug through circuit modification on flip chip packaged ICs requires controlled thinning of substrate silicon. A laser-based tool and methodology for rapid controlled removal of silicon is described. This etching process uses a focused laser
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::09be21c504d9d9d660ce49fac1224fed
https://doi.org/10.1109/relphy.1999.761634
https://doi.org/10.1109/relphy.1999.761634
