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pro vyhledávání: '"Jeffrey Changbing Lee"'
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:763-769
This article presents the studies on the launderability of conductive fabrics with four types of metal coatings (Cu, Ag, Ni/Cu, or Ni/Cu/Co), respectively, which are laminated to three common fabrics (spandex, nylon, and denim) using thermoplastic ur
Autor:
null Jeffrey ChangBing Lee, null Chi-Ko Yu, null Graver Chang, null Tina Shao, null Cherie Chen, null Xiang-Kai.Meng, Matt Brown
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
In the study, instead of electrical resistance monitoring in JEDEC JESD22–B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solde
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 1/ 1/2012, p212-216, 5p