Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Jeffrey Changbing Lee"'
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:763-769
This article presents the studies on the launderability of conductive fabrics with four types of metal coatings (Cu, Ag, Ni/Cu, or Ni/Cu/Co), respectively, which are laminated to three common fabrics (spandex, nylon, and denim) using thermoplastic ur
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 1/ 1/2012, p212-216, 5p
Autor:
null Jeffrey ChangBing Lee, null Chi-Ko Yu, null Graver Chang, null Tina Shao, null Cherie Chen, null Xiang-Kai.Meng, Matt Brown
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
In the study, instead of electrical resistance monitoring in JEDEC JESD22–B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solde
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; May2020, Vol. 10 Issue 5, p763-769, 7p
Autor:
Chen, Cheng-Chih, Lee, Jeffrey ChangBing, Lin, Hung-Chieh, Chang, Yu-Hsien, Lee, Dem, Liou, Peggy
Publikováno v:
2014 9th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2014, p418-421, 4p
Publikováno v:
2014 9th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2014, p96-101, 6p
A global supply chain collaboration to synergize technology achievement for Green QFN qualification.
Publikováno v:
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging; 1/ 1/2012, p1083-1088, 6p
Autor:
Coyle, Richard, Parker, Richard, Arfaei, Babak, Mutuku, Francis, Sweatman, Keith, Howell, Keith, Longgood, Stuart, Benedetto, Elizabeth
Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p425-440, 16p