Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Jeffery Lo"'
Autor:
Hanne Van Der Heijden, Benoit Fatou, Diana Sibai, Kacie Hoyt, Maria Taylor, Kin Cheung, Jordan Lemme, Mariesa Cay, Benjamin Goodlett, Jeffery Lo, Melissa M. Hazen, Olha Halyabar, Esra Meidan, Rudy Schreiber, Camilo Jaimes, Kirsten Ecklund, Lauren A. Henderson, Margaret H. Chang, Peter A. Nigrovic, Robert P. Sundel, Hanno Steen, Jaymin Upadhyay
Publikováno v:
Pediatric Rheumatology Online Journal, Vol 20, Iss 1, Pp 1-10 (2022)
Highlights In the current preliminary study, serum proteins associated with pain severity were identified in JIA patients. Pain-associated proteins had functional roles predominantly in immune or inflammatory processes. Correlations of pain-associate
Externí odkaz:
https://doaj.org/article/21b59a1608ff4d0b8f510734562c6859
Autor:
Jordan Lemme, Margaret H. Chang, Lauren A. Henderson, Maria L. Taylor, Robert P. Sundel, Esra Meidan, Olha Halyabar, Mariesa Cay, Jeffery Lo, Hanne Van Der Heijden, Diana Sibai, Camilo Jaimes, Kirsten Ecklund, Peter A. Nigrovic, Benjamin Goodlett, Kacie J Hoyt, Melissa M. Hazen, Jaymin Upadhyay, Rudy Schreiber
Publikováno v:
Seminars in Arthritis and Rheumatism, 51(4), 700-711. W B Saunders Co-Elsevier Inc
Semin Arthritis Rheum
Semin Arthritis Rheum
Introduction: Pain is prevalent in juvenile idiopathic arthritis (JIA). Unknowns regarding the biological drivers of pain complicate therapeutic targeting. We employed neuroimaging to define pain-related neurobiological features altered in JIA. Metho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4e5cb8f2f31dbe54be2ac39d0d85d752
https://cris.maastrichtuniversity.nl/en/publications/3f3e1776-8af3-4e36-85a9-aa800bdf18b5
https://cris.maastrichtuniversity.nl/en/publications/3f3e1776-8af3-4e36-85a9-aa800bdf18b5
Autor:
John Lau, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen, Iris Xu, Margie Li, Y. M. Cheung, Wu Kai, Ji Hao, Rozalia Beica, Tom Taylor, CT Ko, Henry Yang, YH Chen, Sze Pei Lim, NC Lee, Jiang Ran, Koh Sau Wee, Qingxiang Yong, Cao Xi, Mian Tao, Jeffery Lo, Ricky Lee
Publikováno v:
International Symposium on Microelectronics. 2017:000576-000583
This study is for fan-out wafer-level packaging (FOWLP) with chip-first (die face-up) formation. The chips with Cu contact-pads on the front-side and a die attach film (DAF) on the backside are picked and placed face-up on a temporary glass wafer car
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2051715e6fbe15d886935f9db7c010b
https://doi.org/10.4071/isom-2017-tha35_056
https://doi.org/10.4071/isom-2017-tha35_056
Autor:
John Lau, Ming Li, Iris Xu, Tony Chen, Kim Hwee Tan, Zhang Li, Nelson Fan, Eric Kuah, Raymond So, Penny Lo, Y. M. Cheung, Cao Xi, Rozalia Beica, Sze Pei Lim, N.C. Lee, Cheng-Ta Ko, Henry Yang, Y.H. Chen, Mian Tao, Jeffery Lo, Ricky Lee
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5bc22b3c79490748fda0c034e4f2969
https://doi.org/10.1109/ectc.2019.00141
https://doi.org/10.1109/ectc.2019.00141
Publikováno v:
Crystals, Vol 14, Iss 3, p 285 (2024)
Metal-based additive manufacturing (MBAM) has enabled rapid prototyping and one-off production, but the cost of equipment has limited widespread adoption. Recent developments in hybrid filaments and processes have created more accessible methods for
Externí odkaz:
https://doaj.org/article/1e1f80c6aff841c0b7cd5bb5f2f0212c
Autor:
Swapnil Bhattacharya, Harshal Jayesh Kansara, Jeffery Lodge, Carlos A. Diaz, Christopher L. Lewis
Publikováno v:
Frontiers in Materials, Vol 10 (2023)
Biodegradable Mulch Films (BMFs) offer a sustainable alternative to traditional non-degradable (Polyethylene) PE mulch films. However, their slow rate of biodegradation can lead to plastics accumulation in soil. In this study, a commercially availabl
Externí odkaz:
https://doaj.org/article/085ac0c9471d4de9a904db298c6eef82
Autor:
Lina M. Cortes, Jeffery Lo, Adel S. Alobaid, Jeffery Albert, Jennifer L. Gibbs, Abdulaziz S Abu-Melha, Louis M. Lin, Thuan T. Nguyen
Publikováno v:
Journal of endodontics. 40(8)
Introduction:Thisretrospective cohort studycompared clinical and radiographic outcomes of endodontic treatment performed in immature nonvital permanent teeth by apexification (calcium hydroxide or apical barrier with mineral trioxide aggregate) versu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ea3e2f25a358d79a684fc3fbef54e757
https://pubmed.ncbi.nlm.nih.gov/25069909
https://pubmed.ncbi.nlm.nih.gov/25069909
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
Scanning acoustic microscopy (SAM) is the most commonly used method to inspect internal defects of electronic packages. However, in practice, the multiple interface effect will bring many difficulties for ultrasonic inspection. Thus, understanding th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec4c1f66d025a918d7e7a8e6eb90e7c4
https://doi.org/10.1109/emap.2012.6507881
https://doi.org/10.1109/emap.2012.6507881
Publikováno v:
2010 Prognostics and System Health Management Conference.
This study serves to validate the predictive finite element modeling approach for the solder joint thermal fatigue life analysis, with emphasis on the applicability to various lead-free solder joints. The three packages involved in the study are 8×8
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c88b32f641cb9c49f203a96a1787ae0f
https://doi.org/10.1109/phm.2010.5413586
https://doi.org/10.1109/phm.2010.5413586
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
In this paper, the button shear tests of seven kinds of epoxy used for corner/edge bonding of BGA mezzanine connectors are performed firstly for determining adhesive strength between the epoxies and each relevant surface material. The effect of corne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2dea416a59eebadd13ba95835cdc41a
https://doi.org/10.1109/ectc.2010.5490668
https://doi.org/10.1109/ectc.2010.5490668