Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Jeff Rupley"'
Autor:
Gerald Zuraski Zuraski, Quinnell Eric C, Nakra Tarun, Brian C. Grayson, Kitchin Paul E, Edward A. Brekelbaum, Vikas Sinha, Daniel A. Jimenez, Ghiya Ankit, Hensley Ryan, Jeff Rupley
Publikováno v:
ISCA
The Samsung Exynos family of cores are high-performance "big" processors developed at the Samsung Austin Research & Design Center (SARC) starting in late 2011. This paper discusses selected aspects of the microarchitecture of these cores - specifical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a706a633191eab542b78fd4e09d4b32d
https://doi.org/10.1109/isca45697.2020.00015
https://doi.org/10.1109/isca45697.2020.00015
Publikováno v:
ISCA
From multiprocessor scale-up to cache sizes to the number of reorder-buffer entries, microarchitects wish to reap the benefits of more computing resources while staying within power and latency bounds. This tension is quite evident in schedulers, whi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1ca5933f975e440707b3eae152eb3c9a
https://doi.org/10.1145/1273440.1250704
https://doi.org/10.1145/1273440.1250704
Autor:
Jeff Rupley
Publikováno v:
2012 IEEE Hot Chips 24 Symposium (HCS).
This article consists of a collection of slides from the author's conference presentation on Jaguar, AMD's next generation of low power x86 core products and services. Some of the specific topics discussed include: an overview of the Jaguar microarch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b8a30cc97fa8f26370e4e75ae6878c53
https://doi.org/10.1109/hotchips.2012.7476479
https://doi.org/10.1109/hotchips.2012.7476479
Autor:
W. Attrot, Bryan Black, Jeff Rupley, Youfeng Wu, Mauricio Breternitz, Peter G. Sassone, Gabriel H. Loh
Publikováno v:
SBAC-PAD
Bloom Filters are a technique to reduce the effects of conflicts/interference in hash table-like structures. Conventional hash tables store information in a single location which is susceptible to destructive interference through hash conflicts. A Bl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92cb737a512766ffaad790ded940180b
https://doi.org/10.1109/sbac-pad.2008.24
https://doi.org/10.1109/sbac-pad.2008.24
Autor:
Daniel Pantuso, Clair C. Webb, Paul Reed, Pat Morrow, Ned Brekelbaum, Bryan Black, John Paul Shen, Murali Annavaram, Don McCaule, Donald W. Nelson, Sadasivan Shankar, Jeff Rupley, Lei Jiang, John P. Devale, Gabriel H. Loh
Publikováno v:
MICRO
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die stacking is a significant reduction of interconnect both within a die a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::389fe95b26aa4d95e41ad6c2b63aa889
https://doi.org/10.1109/micro.2006.18
https://doi.org/10.1109/micro.2006.18
Autor:
Bryan Black, Murali Annavaram, Ned Brekelbaum, John DeVale, Lei Jiang, Gabriel H. Loh, Don McCaule, Pat Morrow, Donald W. Nelson, Daniel Pantuso, Paul Reed, Jeff Rupley, Sadasivan Shankar, John Shen, Clair Webb
Publikováno v:
2006 39th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO'06); 2006, p469-479, 11p