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pro vyhledávání: '"Jeff A. Zitz"'
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In this paper, we discuss the design of a four (4) chip Multi Component Carrier (MCC) package and feasibility for use in high-end server/mainframe applications. A new class of organic, Chip Scale Package (CSP) and associated design ground rules were
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
This study is focused on geometric optimization of a 2.5D interposer based single die flip-chip package. Parametric analyses using the well-established global-local finite element method (FEM) technique have been conducted on the package at both the