Zobrazeno 1 - 10
of 79
pro vyhledávání: '"Jed W. Pitera"'
Autor:
Edward O. Pyzer-Knapp, Jed W. Pitera, Peter W. J. Staar, Seiji Takeda, Teodoro Laino, Daniel P. Sanders, James Sexton, John R. Smith, Alessandro Curioni
Publikováno v:
npj Computational Materials, Vol 8, Iss 1, Pp 1-9 (2022)
Abstract New tools enable new ways of working, and materials science is no exception. In materials discovery, traditional manual, serial, and human-intensive work is being augmented by automated, parallel, and iterative processes driven by Artificial
Externí odkaz:
https://doaj.org/article/382c3d5fb2d1422982e887ebd4693fc7
Autor:
Amanda C. Engler, Yi-Tsu Chan, Yi Hsiao, Pei-Hua Wang, Jed W. Pitera, Chieh Lin, Joy Cheng, Yufeng J. Tseng, Daniel P. Sanders
Publikováno v:
ACS Applied Polymer Materials. 2:3107-3113
Advances in polymer science have made polymers essential in our everyday life and have yielded unprecedented quantities of data over the past several decades. However, it is still challenging and i...
Autor:
Katsuhiko Hino, Wolf Bocanett, Seiji Takeda, Yasumitsu Orii, Yuta Tsuchiya, Makoto Kogoh, Hsiang-Han Hsu, Kentaro Yano, Toshiyuki Hama, Yenwei Cheng, Daiju Nakano, Daniel P. Sanders, Takumi Hongo, Akihiro Fujita, Dmitry Yu. Zubarev, Hideaki Nakashika, Hiroki Toda, Victoria A. Piunova, Shuichi Hirose, Jed W. Pitera
Publikováno v:
KDD
The discovery of new materials has been the essential force which brings a discontinuous improvement to industrial products' performance. However, the extra-vast combinatorial design space of material structures exceeds human experts' capability to e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4ab4d4786e570322d2daf6ac4e026a16
http://arxiv.org/abs/2004.11521
http://arxiv.org/abs/2004.11521
Autor:
Dmitry Yu. Zubarev, Jed W. Pitera
Publikováno v:
ACS Symposium Series ISBN: 9780841235052
ACS Symposium Series
ACS Symposium Series
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0dba8c63b39de012caf81cf20ea1ef0
https://doi.org/10.1021/bk-2019-1326.ch006
https://doi.org/10.1021/bk-2019-1326.ch006
Publikováno v:
2018 IEEE International Electron Devices Meeting (IEDM).
Hardware has taken on a supporting role in the maturation and proliferation of narrow AI, but will take a leading role to enable the innovation and adoption of broad AI. The concurrent evolution of broad AI with purpose-built hardware will shift trad
Autor:
Daniel P. Sanders, Kristin Schmidt, Elizabeth Lofano, Gabriela Alva, Anindarupa Chunder, Ankit Vora, Jed W. Pitera, Teddie Magbitang, Joy Cheng, Noel Arellano, Leslie E. Thompson
Publikováno v:
ACS Applied Materials & Interfaces. 8:29808-29817
Orientation control of thin film nanostructures derived from block copolymers (BCPs) are of great interest for various emerging technologies like separation membranes, nanopatterning, and energy storage. While many BCP compositions have been develope
Publikováno v:
DSAA
In recent decades, materials science literature and patents have grown exponentially. This has also contributed to an ever-growing challenge whether the literature is current, as there can be a gap between when the patent was filed and when it was ap
Autor:
Teya Topuria, Gregory S. Doerk, Noel Arellano, Jed W. Pitera, Joy Cheng, Daniel P. Sanders, Charles T. Rettner, Leslie E. Krupp, Chi-Chun Liu
Publikováno v:
ACS Nano. 7:276-285
The realization of viable designs for circuit patterns using the dense features formed by block copolymer directed self-assembly (DSA) will require a precise and quantitative understanding of self-assembled feature registration to guiding templates o
Autor:
Andrew Metz, Daiji Kawamura, Cheng Chi, Richard A. Farrell, Matthew E. Colburn, Nelson Felix, Martha I. Sanchez, Daniel P. Sanders, Yongan Xu, Lovejeet Singh, Jed W. Pitera, Chi-Chun Liu, John C. Arnold, Kafai Lai, Desilva Ekmini Anuja, Tsuyoshi Furukawa, Hongyun Cottle, Luciana Meli, Kristin Schmidt, David Hetzer
Publikováno v:
SPIE Proceedings.
Directed self-assembly (DSA) of block copolymers (BCPs) has become a promising patterning technique for 7nm node hole shrink process due to its material-controlled CD uniformity and process simplicity.[1] For such application, cylinder-forming BCP sy