Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Jeb H. Flemming"'
Publikováno v:
International Symposium on Microelectronics. 2016:000299-000304
Glassy materials offer a number of advantages over traditional packaging materials, such as laminates and ceramics including: (1) Better material properties, (2) decreased surface roughness to mitigate current crowding, (3) the ability to create smal
Publikováno v:
International Symposium on Microelectronics. 2012:000781-000784
Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility needs in consumer electronics. Furthermore, IC packaging is w
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000791-000810
Today's packaging has become the limiting element in system cost and performance for IC development. Assembly and packaging technologies have become primary differentiators for manufactures of consumer electronics and the main enabler of small IC pro
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001269-001290
The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; electrical leakage and lack o
Autor:
Gregory A. Ten Eyck, Jason C. Harper, Komandoor E. Achyuthan, David R. Wheeler, Jeb H. Flemming, Dominic S. Raj, Ronen Polsky, Susan M. Brozik, Jaime L. McClain
Publikováno v:
ACS Applied Materials & Interfaces. 1:1591-1598
We present a miniaturized high-throughput sensor array that will augment biofuel technology by facilitating in situ biochemical measurements upon micrometer-scale surfaces of leaves, stems, or petals. We used semiconductor processing to photopattern
Autor:
Zhu Chen, Helen K. Baca, Susan M. Brozik, Eric C. Carnes, Hongyou Fan, Margaret Werner-Washburne, Seema Singh, Gabriel P. Lopez, DeAnna M. Lopez, Darren R. Dunphy, Jeb H. Flemming, Carlee Erin Ashley, Nanguo Liu, C. Jeffrey Brinker
Publikováno v:
Science. 313:337-341
Amphiphilic phospholipids were used to direct the formation of biocompatible, uniform silica nanostructures in the presence of Saccharomyces cerevisiae and bacterial cell lines. The cell surfaces organize multilayered phospholipid vesicles that inter
Publikováno v:
Sensors and Actuators B: Chemical. 113:376-381
We present and evaluate a new approach to cell immobilization for use in cell-based biosensors. We have fabricated a microfluidic channel using poly(dimethylsiloxane) (PDMS) with cell entrapment posts for the gentle packing and immobilization of yeas
Publikováno v:
International Symposium on Microelectronics. 2011:000199-000201
The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; (1) electrical leakage and (2
Autor:
Suzanne Ma, Chris J. Cornelius, Kevin R. Zavadil, Cy Fujimoto, Susan M. Brozik, Joanne V. Volponi, David Ingersoll, Randy J. Shul, J. Bruce Kelley, M. J. Kelly, Jim Novak, Michael Howard Beggans, William Kent Schubert, Chad L. Staiger, Stanley H. Kravitz, Jeanne Sergeant, Todd M. Alam, James J. Hudgens, Carrie Schmidt, Jeb H. Flemming, James M. E. Harper, Christopher A. Apblett, Stephen P. Meserole, Monica Manginell, Michael A. Hickner, Andrew William Walker, Theodore T. Borek, Sarah Gretchen Rich, Daniel H. Doughty, David W. Peterson, Blake A. Simmons, Gregory A. Roberts, Jason Podgorski, Stephen Keeling Eisenbies, Patricia L. Dolan, Stephen A. Casalnuovo, Swapnil R. Chhabra, Brian R. Cherry
Christopher Apblett, Kent Schubert, Bruce Kelley, Andrew Walker, Blake Simmons, Ted Borek, Stephen Meserole, Todd Alam, Brian Cherry, Greg Roberts, Jim Novak, Jim Hudgens, Dave Peterson, Jason Podgorski, Susan Brozik, Jeb Flemming, Stan Kravitz, Davi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ee0625ee1650e0671282b3cb55d52b6
https://doi.org/10.2172/876287
https://doi.org/10.2172/876287