Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Jeannine M. Trewhella"'
Autor:
L. Shan, Christian Schuster, M. Nystrom, Frank R. Libsch, Jeremy D. Schaub, Punit P. Chiniwalla, Petar Pepeljugoski, Roger Dangel, Daniel M. Kuchta, H. Nyikal, Folkert Horst, Christian W. Baks, Cornelia K. Tsang, Chao-Kun Lin, Russell A. Budd, Gary R. Trott, S. Hegde, Bert Jan Offrein, D. Kucharski, Laurent Schares, Fuad E. Doany, M.R.T. Tan, Jeffrey A. Kash, David P. Bour, Ashish Tandon, D. Guckenberger, Chirag S. Patel, Richard A. John, D.W. Dolfi, Jeannine M. Trewhella, Clint L. Schow, Young H. Kwark, J. Rosner
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 12:1032-1044
In the "Terabus" optical interconnect program, optical data bus technologies are developed that will support terabit/second chip-to-chip data transfers over organic cards within high-performance servers, switch routers, and other intensive computing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::058b19d0233487980ed7e7f458f58bee
https://doi.org/10.1109/jstqe.2006.881906
https://doi.org/10.1109/jstqe.2006.881906
Publikováno v:
IBM Journal of Research and Development. 47:251-258
Optical subassemblies (OSAs) are the highest-cost component of datacom transceivers, and therefore the component that is most constrained by production cost concerns. While transceiver costs have declined, operating rates have increased from 266 Mb/s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc71456e3584f947961c83a1e45549da
https://doi.org/10.1147/rd.472.0251
https://doi.org/10.1147/rd.472.0251
Publikováno v:
IEEE Transactions on Advanced Packaging. 25:248-254
A 50 Gb/s package for SiGe BiCMOS 4:1 multiplexer and 1:4 demultiplexer targeting SONET OC-768 serial communication systems is introduced in this work. The package was designed to facilitate bit-error-rate tests and constructed with high-speed coaxia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74d01aa09bdcee74ef06394909a0472c
https://doi.org/10.1109/tadvp.2002.803268
https://doi.org/10.1109/tadvp.2002.803268
Autor:
Dennis Leon Karst, W. K. Hogan, J. A. Weirick, Dianne L. Lacey, Modest M. Oprysko, Glen Walden Johnson, M. D. Peterson, M.S. Cohen, Jeannine M. Trewhella, S. M. Defoster
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 20:256-263
The optical subassembly is a major contributor to the cost of a fiberoptic computer data link. A technology for low-cost fabrication of optical subassemblies is described, with emphasis on a transmitter subassembly designed for fiber-channel standard
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::766316442173a04d949ac679cb46ac54
https://doi.org/10.1109/96.618225
https://doi.org/10.1109/96.618225
Autor:
D. Lacey, Jeannine M. Trewhella, M.F. Cina, Ephraim Bemis Flint, T. Caulfield, Ch. Harder, Peter Vettiger, K. P. Jackson, Young H. Kwark, P. Buchmann
Publikováno v:
Journal of Lightwave Technology. 12:1185-1191
An optoelectronic transceiver module is described consisting of a four-channel AlGaAs integrated laser/monitor transmitter and a four-channel GaAs MESFET integrated detector/preamp receiver. The optoelectronic chips are flip-chip, solder-bump bonded
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90ca2550a877131402c2f29e4a50b3b1
https://doi.org/10.1109/50.301811
https://doi.org/10.1109/50.301811
Autor:
C. Harder, K. P. Jackson, P. Vettiger, P. Buchmann, D. Lacey, Jeannine M. Trewhella, Ephraim Bemis Flint, M.F. Cina
Publikováno v:
Summer Topical Meeting Digest on Broadband Analog and Digital Optoelectronics, Optical Multiple Access Networks, Integrated Optoelectronics, Smart Pixels.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e9a767b35230a2ea59b7bb8daf70875
https://doi.org/10.1109/leosst.1992.697470
https://doi.org/10.1109/leosst.1992.697470
Autor:
Christian W. Baks, S. Hegde, Lei Shan, D.M. Kuchta, Jeffrey A. Kash, Jeannine M. Trewhella, Young H. Kwark, Fuad E. Doany
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Terabus is a high-speed optoelectronic package designed to run at 10-20 Gb/s/channel over 48 channels of optical/electrical links. The Terabus package consists of an optochip that can be passively attached to an optocard with processes similar to tho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::251180ab7e5c69e92a67e91f33793136
https://doi.org/10.1109/ectc.2005.1442049
https://doi.org/10.1109/ectc.2005.1442049
Publikováno v:
Electrical Performance of Electronic Packaging.
The vertical interconnects used in printed circuit boards, known as vias, are becoming increasingly critical to interconnect performance with ever increasing system data rates. To explore the effects of vias on system link performance, both simulatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d23a55b4568e63f54e3087a5482f430
https://doi.org/10.1109/epep.2004.1407555
https://doi.org/10.1109/epep.2004.1407555
Autor:
Daniel M. Kuchta, D. Lin, Jeannine M. Trewhella, M.R.T. Tan, B.J. Offrein, Petar Pepeljugoski, L. Shan, Laurent Schares, Ashish Tandon, Clint L. Schow, Christian W. Baks, Cornelia K. Tsang, Punit P. Chiniwalla, Jeffrey A. Kash, Russell A. Budd, D. Guckenberger, Chirag S. Patel, Gary R. Trott, Roger Dangel, Jeremy D. Schaub, Fuad E. Doany, J. Rosner, Christian Schuster, Young H. Kwark, M. Nystrom, D. Kucharski, Frank R. Libsch
Publikováno v:
2005 IEEE LEOS Annual Meeting Conference Proceedings.
Terabus is based on a chip-like optoelectronic packaging structure (Optochip) assembled directly onto an organic card with integrated waveguides (Optocard). To-date, Terabus has demonstrated 4times12-array optical transmitters and receivers operating
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f63e959f3b621e0f8bdb8927ac4a5240
https://doi.org/10.1109/leos.2005.1548029
https://doi.org/10.1109/leos.2005.1548029
Autor:
S. Hegde, Russell A. Budd, Roger Dangel, A. Nystrom, Laurent Schares, M. Tan, Jeannine M. Trewhella, Dennis L. Rogers, D.W. Dolfi, Fuad E. Doany, Gary R. Trott, Ashish Tandon, J. Rosner, D. Guckenberger, Punit P. Chiniwalla, Jeffrey A. Kash, Chirag S. Patel, Jeremy D. Schaub, Young H. Kwark, Richard A. John, L. Shan, Daniel M. Kuchta, B.J. Offrein, Christian Schuster, Christian W. Baks, D. Kucharski, Cornelia K. Tsang, C.K. Lin, Frank R. Libsch, Clint L. Schow, Petar Pepeljugoski
Publikováno v:
31st European Conference on Optical Communications (ECOC 2005).
Technologies for Tb/s-class optical links are demonstrated, including an organic card with 48 integrated waveguides and a silicon-carrier interposer. 4×12-array optical transmitters and receivers operate up to 20 Gb/s and 14 Gb/s per channel, respec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d71222b2bdb64f88ff4aa77c8fda2bcd
https://doi.org/10.1049/cp:20050521
https://doi.org/10.1049/cp:20050521