Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Jean-Michel Morelle"'
Autor:
Roland Mahayri, Mohammed Ali Bousnina, Silvana Mercone, Ky-Lim Tan, Jean-Michel Morelle, Frédéric Schoenstein, Noureddine Jouini
Publikováno v:
Materials; Volume 15; Issue 22; Pages: 8276
The present work concerns the intermetallic compound (IMC) existing in the Ag–Sn system and its potential use in electronics as attachment materials allowing the adhesion of the chip to the substrate forming the power module. First, we present the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b1833369c7f14c0e5554de7c6f3db68a
Autor:
Laurent Vivet, L. Benabou, Van-Nhat Le, Jean-Michel Morelle, Quang Bang Tao, Fathi Ben Ouezdou, Ky-Lim Tan
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science. 231:3818-3830
This paper makes a focus on the design of a micro-testing machine used for evaluating the mechanical properties of solder alloys. The different parts of the testing device have been developed and assembled in a manner that will facilitate the study o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfcf06efeafae60de087b80c90368907
https://doi.org/10.1177/0954406216654728
https://doi.org/10.1177/0954406216654728
Autor:
Richard Lallemand, Jean-Louis Blanchard, Jean-Michel Morelle, Gérard Coquery, Blaise Rouleau, Gael Blondel, Laurent Dupont
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2010, 50 (9-11), pp 1804-1809. ⟨10.1016/j.microrel.2010.07.127⟩
Microelectronics Reliability, Elsevier, 2010, 50 (9-11), pp 1804-1809. ⟨10.1016/j.microrel.2010.07.127⟩
Cost, weight and size reduction constrained designers of power electronic for micro hybrid vehicle to use power MOSFET under extreme conditions like avalanche mode. This paper shows the influence of the solder voids onto the die temperature distribut
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5b39f699b4a8fd4c2dfffb2a8afa41eb
https://doi.org/10.1016/j.microrel.2010.07.127
https://doi.org/10.1016/j.microrel.2010.07.127
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
The paper is concerned with the development of a micro testing machine for solder joint specimens. The micro tester has been developed for testing a new solder alloy, namely Innolot (Sn-Ag3.7Cu0.65Bi3.0Sb1.43Ni0.15), under various cross-beam speeds a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca3ef5bd99c7b230e769b802a1332a77
https://doi.org/10.1109/eptc.2015.7412360
https://doi.org/10.1109/eptc.2015.7412360
Publikováno v:
Journal of Applied Polymer Science. 135:46105
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01e0638bbe28062fcfa5d397a5ba6943
https://doi.org/10.1002/app.46105
https://doi.org/10.1002/app.46105
Autor:
Nadim Alayli, Armelle Girard, Jean-Michel Morelle, Philippe Pougnet, Ky-Lim Tan, Pierre-Richard Dahoo
Publikováno v:
Reliability and Materials Issues of Semiconductor Optical and Electrical Devices and Material, MRS Proceedings, Vol 1195
Reliability and Materials Issues of Semiconductor Optical and Electrical Devices and Material, MRS Proceedings, Vol 1195, 2009, Warrendale, United States. 1195-B07-04 (4 p.), ⟨10.1557/PROC-1195-B07-04⟩
Scopus-Elsevier
Reliability and Materials Issues of Semiconductor Optical and Electrical Devices and Material, MRS Proceedings, Vol 1195, 2009, Warrendale, United States. 1195-B07-04 (4 p.), ⟨10.1557/PROC-1195-B07-04⟩
Scopus-Elsevier
Mechatronic systems designed to comply to new EU directives are studied through interconnections by electronic or photonic probes, SEM, TEM, SE or 3D Tomography. Leaded and lead free modules assembled by standard interconnection technologies are stud
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b49a88fcba8d517ff8688178fb4f40d8
https://doi.org/10.1557/proc-1195-b07-04
https://doi.org/10.1557/proc-1195-b07-04
Publikováno v:
SAE Technical Paper Series.
In the near future the automotive industry shall introduce a wide range of new, high technological functions and applications. These are being driven by the industries demand for a reduction in fuel consumption, pollutant emissions and an overall imp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::702c66d3c927cd8a2b05d0df6ad95f00
https://doi.org/10.4271/2005-01-0557
https://doi.org/10.4271/2005-01-0557
Conference
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