Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Jean-Jou Chen"'
Autor:
Yan-Jun Fan, John H. Lau, Kai-Ming Yang, Hsing-Ning Liu, Tzvy-Jang Tseng, Eagle Lin, Puru Bruce Lin, Curry Lin, Leo Chang, Jean-Jou Chen, Po-Chun Huang, Cheng-Ta Ko, Tim Xia, Winnie Lu, Chia-Yu Peng
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 18:29-39
In this study, the reliability of the solder joints of a heterogeneous integration of one large chip (10 × 10 mm) and two smaller chips (7 × 5 mm) by a fan-out method with a redistribution layer-first substrate fabricated on a 515 × 510-mm panel i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b8a304f5b03066bbe5ed60b583c39ef
https://doi.org/10.4071/imaps.1419800
https://doi.org/10.4071/imaps.1419800
Autor:
Tzvy-Jang Tseng, John H. Lau, Tim Xia, Chia-Yu Peng, Kai-Ming Yang, Po-Chun Huang, Cheng-Ta Ko, Puru Bruce Lin, Jean-Jou Chen, Eagle Lin, Winnie Lu, Curry Lin, Leo Chang
Publikováno v:
International Symposium on Microelectronics. 2020:000042-000050
In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the materials, process, fabrication, and reliability of a heterogeneous in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::639c9ce0320694dbb789cf22ab6a5643
https://doi.org/10.4071/2380-4505-2020.1.000042
https://doi.org/10.4071/2380-4505-2020.1.000042
Autor:
Patrick Po-Chun Huang, John H. Lau, Chia-Yu Peng, Puru Bruce Lin, Jean-Jou Chen, Leo Chang, Hsing-Ning Liu, Eagle Lin, Cheng-Ta Ko, Tzyy-Jang Tseng, Tim Xia, Kai-Ming Yang
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1125-1137
In this article, the fan-out chip-last panel-level packaging for heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and simulation of thermomechanical reliability of a heterogeneous integrati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1df915bbdaec84b7ba821bc7d0fe0a8b
https://doi.org/10.1109/tcpmt.2020.2996658
https://doi.org/10.1109/tcpmt.2020.2996658
Autor:
Puru Bruce Lin, Jean-Jou Chen, John H. Lau, Cheng-Ta Ko, Po-Chun Huang, Curry Lin, Yan-Jun Fan, Leo Chang, Kai-Ming Yang, Tim Xia, Chia-Yu Peng, Winnie Lu, Eagle Lin, Hsing-Ning Liu, Tzvy-Jang Tseng
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this study, the reliability of the solder joints of a heterogeneous integration of one large chip and two smaller chips by a fan-out method with a redistribution-layer (RDL)-first substrate fabricated on a panel is investigated. Emphasis is placed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2eb964bfd7afa7a2f47dd5d5c3156c65
https://doi.org/10.1109/ectc32696.2021.00067
https://doi.org/10.1109/ectc32696.2021.00067
Autor:
Kai-Ming Yang, Tim Xia, Chia-Yu Peng, Cheng-Ta Ko, Po-Chun Huang, John H. Lau, Tzvy-Jang Tseng, Hsing Ning Liu, Puru Bruce Lin, Jean-Jou Chen
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this study, the fan-out chip-last panel-level packaging for heterogeneous integrations is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of a heterogeneous integration of one large chip (10mm x 10m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97d04f8f5b793e26fd568ec0f91517bf
https://doi.org/10.1109/ectc32862.2020.00062
https://doi.org/10.1109/ectc32862.2020.00062
Autor:
Lau, John H., Cheng-Ta Ko, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Lin, Puru Bruce, Jean-Jou Chen, Po-Chun Huang, Tzvy-Jang Tseng, Lin, Eagle, Leo Chang, Lin, Curry, Yan-Jun Fan, Hsing-Ning Liu, Lu, Winnie
Publikováno v:
Journal of Microelectronic & Electronic Packaging; 2021, Vol. 18 Issue 2, p29-39, 11p
Autor:
Lau, John H., Cheng-Ta Ko, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, Jean-Jou Chen, Po-Chun Huang, Tzvy-Jang Tseng, Eagle Lin, Leo Chang, Curry Lin, Winnie Lu
Publikováno v:
Journal of Microelectronic & Electronic Packaging; Jul2020, Vol. 17 Issue 3, p89-98, 10p