Zobrazeno 1 - 10
of 54
pro vyhledávání: '"Jean-Guy Tartarin"'
Publikováno v:
Electronics; Volume 11; Issue 5; Pages: 684
Electronics
Electronics, 2022, 11 (5), pp.684. ⟨10.3390/electronics11050684⟩
Electronics
Electronics, 2022, 11 (5), pp.684. ⟨10.3390/electronics11050684⟩
International audience; Silicon technologies for HF applications have been proven for more than two decades, and technologies have greatly evolved. Whether CMOS or BiCMOS technologies, the unique combination of radio frequency, baseband, and digital
Autor:
Jean-Guy Tartarin, Yannick Guhel, Marie Lesecq, Etienne Okada, Bertrand Boudart, Mahmoud Abou Daher, Jean Claude De Jaeger, Nicolas Defrance
Publikováno v:
Microwave and Optical Technology Letters
Microwave and Optical Technology Letters, 2021, 63 (9), pp.2376-2380. ⟨10.1002/mop.32919⟩
Microwave and Optical Technology Letters, Wiley, 2021, 63 (9), pp.2376-2380. ⟨10.1002/mop.32919⟩
Microwave and Optical Technology Letters, 2021, 63 (9), pp.2376-2380. ⟨10.1002/mop.32919⟩
Microwave and Optical Technology Letters, Wiley, 2021, 63 (9), pp.2376-2380. ⟨10.1002/mop.32919⟩
International audience; In this paper, electrical and thermal analysis of short gate length AlGaN/GaN HEMTs (high electron mobility transistors) transferred onto diamond substrate through aluminum nitride (AlN) layer are provided. The specific transf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::61b56cb1ca83117ab3fdc0f70291f479
https://hal.science/hal-03249292
https://hal.science/hal-03249292
Publikováno v:
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2019, 66 (12), pp.5289-5294. ⟨10.1109/TED.2019.2947693⟩
IEEE Transactions on Electron Devices, 2019, 66 (12), pp.5289-5294. ⟨10.1109/TED.2019.2947693⟩
IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2019, 66 (12), pp.5289-5294. ⟨10.1109/TED.2019.2947693⟩
IEEE Transactions on Electron Devices, 2019, 66 (12), pp.5289-5294. ⟨10.1109/TED.2019.2947693⟩
International audience; In this article, we report for the first time that the well-established diffusion noise can be apparently increased in large proportions and that such a situation can be very common at some specific frequencies in the p-n junc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b80f30f91978f9f0795a97b0b1803aea
https://hal.archives-ouvertes.fr/hal-02388640/file/TED-ACCEPTED-FINAL_HAL.pdf
https://hal.archives-ouvertes.fr/hal-02388640/file/TED-ACCEPTED-FINAL_HAL.pdf
Autor:
Jean-Guy Tartarin
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2019, 100-101, pp.113359. ⟨10.1016/j.microrel.2019.06.051⟩
Microelectronics Reliability, 2019, 100-101, pp.113359. ⟨10.1016/j.microrel.2019.06.051⟩
Microelectronics Reliability, Elsevier, 2019, 100-101, pp.113359. ⟨10.1016/j.microrel.2019.06.051⟩
Microelectronics Reliability, 2019, 100-101, pp.113359. ⟨10.1016/j.microrel.2019.06.051⟩
International audience; SiGe and GaN technologies have achieved rapid development over the last two decades. High level of RF circuit integration on Si low cost substrates open the way for large development of SiGe HBTs, while needs for high power de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::890883d5ac4c50ca7765b2d08bdeb66c
https://hal.archives-ouvertes.fr/hal-02388674/document
https://hal.archives-ouvertes.fr/hal-02388674/document
Autor:
Jean-Guy Tartarin, Remy Leblanc, Hassan Maher, Francois Boone, Christophe Viallon, Boris Berthelot
Publikováno v:
2019 IEEE/MTT-S International Microwave Symposium-IMS 2019
2019 IEEE/MTT-S International Microwave Symposium-IMS 2019, Jun 2019, Boston, United States. pp.1399-1402, ⟨10.1109/MWSYM.2019.8701085⟩
IEEE/MTT-S International Microwave Symposium (IMS 2019)
IEEE/MTT-S International Microwave Symposium (IMS 2019), Jun 2019, Boston, United States. pp.1399-1402, ⟨10.1109/MWSYM.2019.8701085⟩
2019 IEEE/MTT-S International Microwave Symposium-IMS 2019, Jun 2019, Boston, United States. pp.1399-1402, ⟨10.1109/MWSYM.2019.8701085⟩
IEEE/MTT-S International Microwave Symposium (IMS 2019)
IEEE/MTT-S International Microwave Symposium (IMS 2019), Jun 2019, Boston, United States. pp.1399-1402, ⟨10.1109/MWSYM.2019.8701085⟩
International audience; High data rate communications have become possible due to improvements in microelectronics, and is based on new topological concepts of architecture. The development of 5G networks using the Ka-band is one of the challenges fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::37a5efa5879f35cb721ded2f7271faad
https://hal.archives-ouvertes.fr/hal-02315126/file/IMS_corechipKa_Constellation_final.pdf
https://hal.archives-ouvertes.fr/hal-02315126/file/IMS_corechipKa_Constellation_final.pdf
Autor:
Jean-Guy TARTARIN
Publikováno v:
International Journal of Information Science and Technology, Vol 3, Iss 1, Pp 3-13 (2019)
III-V wide bandgap disruptive technology is positioned as a leader for high power components operating at high frequency or under switch mode conditions of operation. Further investigation to address elevated junction temperatures of these transistor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3d8d1645974063743493e18c5ee2f611
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, 2020, 114, pp.113895. ⟨10.1016/j.microrel.2020.113895⟩
Microelectronics Reliability, Elsevier, 2020, 114, pp.113895. ⟨10.1016/j.microrel.2020.113895⟩
Microelectronics Reliability, 2020, 114, pp.113895. ⟨10.1016/j.microrel.2020.113895⟩
Microelectronics Reliability, Elsevier, 2020, 114, pp.113895. ⟨10.1016/j.microrel.2020.113895⟩
International audience; The charges in wide bandgap Gallium Nitride (GaN) High Electron Mobility Transistors (HEMT) can be identified by means of various methods such as electrical transient and pulsed measurements, or noise spectroscopy methods, usu
Publikováno v:
13th European Microwave Integrated Circuits Conference (EuMIC 2018)
13th European Microwave Integrated Circuits Conference (EuMIC 2018), Sep 2018, Madrid, Spain. pp.17-20, ⟨10.23919/EuMIC.2018.8539919⟩
13th European Microwave Integrated Circuits Conference (EuMIC 2018), Sep 2018, Madrid, Spain. pp.17-20, ⟨10.23919/EuMIC.2018.8539919⟩
International audience; The rapid development of III-V technologies for telecommunication and radar markets need the meeting of performances (power, frequency) criteria as well as reliability assessment. Nitride HEMT technologies are known to reveal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::73e7d447408bbec77475c78de5869c49
https://hal.laas.fr/hal-02088200
https://hal.laas.fr/hal-02088200
Publikováno v:
2018 19th IEEE Mediterranean Electrotechnical Conference (MELECON).
III-V wide bandgap disruptive technology is firmly positioned as a leader for high power segments operating at high frequency or under switching mode. Still, it is needed to investigate these transistors to push the maturity towards higher levels and
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2015, 55 (9-10), pp.1714-1718. ⟨10.1016/j.microrel.2015.06.122⟩
Microelectronics Reliability, 2015, 55 (9-10), pp.1714-1718. ⟨10.1016/j.microrel.2015.06.122⟩
Microelectronics Reliability, Elsevier, 2015, 55 (9-10), pp.1714-1718. ⟨10.1016/j.microrel.2015.06.122⟩
Microelectronics Reliability, 2015, 55 (9-10), pp.1714-1718. ⟨10.1016/j.microrel.2015.06.122⟩
International audience; This work focuses on short term and long term time evolution of charges in the context of early identification of failure mechanisms in AlGaN/GaN High Electron Mobility Transistors (HEMTs). High power and high frequency device