Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Jean-Baptiste Fonder"'
Publikováno v:
Materials Science Forum. 858:812-816
SiC MOSFET are now commercially available and show promising performances when considering static losses, commutations and long term reliability. The devices may face short-circuit conditions and knowing their capibility in terms of critical time and
Autor:
Dominique Planson, Jean Baptiste Fonder, Pascal Bevilacqua, Hervé Morel, Luong Viet Phung, Beverley Choucoutou, Besar Asllani
Publikováno v:
Materials Science Forum
Materials Science Forum, Trans Tech Publications Inc., 2019, 963, pp.567-571. ⟨10.4028/www.scientific.net/MSF.963.567⟩
Proceedings of the 2018 European Conference on Silicon Carbide and Related Materials
ECSCRM'18
ECSCRM'18, Sep 2018, Birmingham, United Kingdom. pp.WE.P.RD2
Materials Science Forum, Trans Tech Publications Inc., 2019, 963, pp.567-571. ⟨10.4028/www.scientific.net/MSF.963.567⟩
Proceedings of the 2018 European Conference on Silicon Carbide and Related Materials
ECSCRM'18
ECSCRM'18, Sep 2018, Birmingham, United Kingdom. pp.WE.P.RD2
This paper reports the design, the processing, the static characterisation, the switching behaviour and the high current stress test of 10 kV aimed 4H-SiC bipolar diodes. The actual breakdown voltage of the selected devices is between 7 kV and 8 kV.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6ef85d3e12104b537454b37b4fc0575e
https://hal.archives-ouvertes.fr/hal-02060334
https://hal.archives-ouvertes.fr/hal-02060334
Autor:
Jean Baptiste Fonder, Dominique Planson, Luong Viet Phung, Pierre Brosselard, Besar Asllani, Pascal Bevilacqua
Publikováno v:
Materials Science Forum
Materials Science Forum, Trans Tech Publications Inc., 2018, 924, pp.593-596. ⟨10.4028/www.scientific.net/MSF.924.593⟩
International Conference on Silicon Carbide and Related Materials 2017 (ICSCRM 2017)
International Conference on Silicon Carbide and Related Materials 2017 (ICSCRM 2017), Sep 2017, Washington DC, United States
The International Conference on Silicon Carbide and Related Materials (ICSCRM 2017)
The International Conference on Silicon Carbide and Related Materials (ICSCRM 2017), Sep 2017, Washington D.C., United States
Materials Science Forum, Trans Tech Publications Inc., 2018, 924, pp.593-596. ⟨10.4028/www.scientific.net/MSF.924.593⟩
International Conference on Silicon Carbide and Related Materials 2017 (ICSCRM 2017)
International Conference on Silicon Carbide and Related Materials 2017 (ICSCRM 2017), Sep 2017, Washington DC, United States
The International Conference on Silicon Carbide and Related Materials (ICSCRM 2017)
The International Conference on Silicon Carbide and Related Materials (ICSCRM 2017), Sep 2017, Washington D.C., United States
International audience; In this paper we will present the results of repetitive surge stress carried out on six 3.3 kV-5A Ti/Ni 4H-SiC JBS diodes. Repetitive current peaks between 10 A and 24 A have been applied and some diodes were able to endure 10
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0bf88d96bfad9709aa6f9e8276e952cb
https://hal.archives-ouvertes.fr/hal-01857352/document
https://hal.archives-ouvertes.fr/hal-01857352/document
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques
IEEE Transactions on Microwave Theory and Techniques, Institute of Electrical and Electronics Engineers, 2016, 64 (3), pp.756-766. ⟨10.1109/TMTT.2016.2519342⟩
IEEE Transactions on Microwave Theory and Techniques, 2016, 64 (3), pp.756-766. ⟨10.1109/TMTT.2016.2519342⟩
IEEE Transactions on Microwave Theory and Techniques, Institute of Electrical and Electronics Engineers, 2016, 64 (3), pp.756-766. ⟨10.1109/TMTT.2016.2519342⟩
IEEE Transactions on Microwave Theory and Techniques, 2016, 64 (3), pp.756-766. ⟨10.1109/TMTT.2016.2519342⟩
International audience; Failure mechanisms in AlGaN/GaN HEMT RF power amplifiers implemented on silicon substrate and envisaging radar operating conditions are investigated in this paper. Several power amplifier prototypes have been designed, fabrica
Autor:
Hichame Maanane, Cécile Genevois, Cédric Duperrier, Farid Temcamani, Jean Baptiste Fonder, Olivier Latry, Laurence Chevalier
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2012, pp.2205. ⟨10.1016/j.microrel.2012.06.053⟩
Microelectronics Reliability, 2012, pp.2205. ⟨10.1016/j.microrel.2012.06.053⟩
23rd EUROPEAN SYMPOSIUM ON THE RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS
23rd EUROPEAN SYMPOSIUM ON THE RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS, Oct 2012, Cagliari, Italy. pp.2205
HAL
Microelectronics Reliability, Elsevier, 2012, pp.2205. ⟨10.1016/j.microrel.2012.06.053⟩
Microelectronics Reliability, 2012, pp.2205. ⟨10.1016/j.microrel.2012.06.053⟩
23rd EUROPEAN SYMPOSIUM ON THE RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS
23rd EUROPEAN SYMPOSIUM ON THE RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS, Oct 2012, Cagliari, Italy. pp.2205
HAL
International audience; This paper deals with the physical study of the Schottky contact after pulsed-RF saturated life test under enhanced drain bias voltage on power HEMTs. Electrical measurements showed a pinch-off voltage (VP) shift, a decrease o
Autor:
Pascal Dherbécourt, Farid Temcamani, Olivier Latry, Hichame Maanane, Karine Dehais-Mourgues, Cédric Duperrier, Jean-Baptiste Fonder, Jean-Pierre Sipma
This chapter describes how to perform power microwave transistors lifetime tests in operational conditions. The originality of this test bench is its ability to monitor automatically component performance during thousands of hours and to apply electr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e83b22b92a54a15811d625f36659b4c
https://doi.org/10.1016/b978-1-78548-014-0.50002-5
https://doi.org/10.1016/b978-1-78548-014-0.50002-5
This chapter concerns the study of radiofrequency power amplifiers’ reliability, for RAdiowave Detection And Ranging (RADAR) applications, based on gallium nitride transistors. Compared to the literature, this study combines electrical characteriza
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f02d290d424ee67c1457b28854a0d77
https://doi.org/10.1016/b978-1-78548-014-0.50008-6
https://doi.org/10.1016/b978-1-78548-014-0.50008-6
Autor:
Bouzid Ait Amir, Jean-Loup Alvarez, Younes Aoues, Christian Chong, Pierre Richard Dahoo, Karine Dehais-Mourgues, Pascal Dherbecourt, Cédric Duperrier, Abdelkhalak El Hami, Jean-Baptiste Fonder, Christian Gautier, Armelle Girard, Malika Khettab, Olivier Latry, Hichame Maanane, Abderahman Makhloufi, Eric Pieraerts, Philippe Pougnet, Jean-Pierre Sipma, Farid Temcamani
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf251089899c8181758439ad3351538e
https://doi.org/10.1016/b978-1-78548-014-0.50012-8
https://doi.org/10.1016/b978-1-78548-014-0.50012-8
Publikováno v:
2014 International Conference on Multimedia Computing and Systems (ICMCS)
2014 International Conference on Multimedia Computing and Systems (ICMCS), Apr 2014, Marrakech, France. ⟨10.1109/ICMCS.2014.6911421⟩
ICMCS
2014 International Conference on Multimedia Computing and Systems (ICMCS), Apr 2014, Marrakech, France. ⟨10.1109/ICMCS.2014.6911421⟩
ICMCS
This paper presents measurement of AlGaN/GaN HEMT temperature with two techniques. Coupling of infrared thermography and electrical characterization of drain current shows good agreement of both techniques. They are complementary and may allow spatia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6d2d1468e9accc960e8ed94e9beaf6e7
https://hal.archives-ouvertes.fr/hal-01740889
https://hal.archives-ouvertes.fr/hal-01740889
Autor:
Michel Stanislawiak, Cédric Duperrier, Philippe Eudeline, Farid Temcamani, Jean Baptiste Fonder, Hichame Maanane, Olivier Latry
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2012, In press. ⟨10.1016/j.microrel.2012.04.024⟩
Microelectronics Reliability, 2012, In press. ⟨10.1016/j.microrel.2012.04.024⟩
Microelectronics Reliability, Elsevier, 2012, In press. ⟨10.1016/j.microrel.2012.04.024⟩
Microelectronics Reliability, 2012, In press. ⟨10.1016/j.microrel.2012.04.024⟩
International audience; AlGaN/GaN HEMTs are on the way to lead the RF-power amplification field according to their outstanding performances. However, due to its relative youth, reliability studies in several types of operating conditions allow to und
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::269f77ad544d970794e87ed7e01fd564
https://hal.archives-ouvertes.fr/hal-00735899
https://hal.archives-ouvertes.fr/hal-00735899