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pro vyhledávání: '"Jean-Baptiste Chaumont"'
Autor:
Paul Blondeau, Jean-Baptiste Chaumont, Mikailou Thiam, Frédéric Raynal, Dominique Suhr, Vincent Mevellec, Laurianne Religieux
Publikováno v:
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).
Copper electrodeposition for on-chip interconnection has been widely described in the semiconductor industry. Most copper plating chemistries currently used for copper interconnects are acidic, involving special additives that provide bottom up fill
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::806d408ae5230c8b4ca2d386f9c21a14
https://doi.org/10.1109/iitc-amc.2016.7507725
https://doi.org/10.1109/iitc-amc.2016.7507725
