Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Jean Marie Foray"'
Autor:
Magali Davenet, P. Nesladek, E. Foca, S. HadjRabah, Jean-Marie Foray, Arnaud Favre, M. Tissier, P. Sergent, E. Veran, J. Palisson, F. Dufaye, V. Baudiquez, Bertrand Bellet, S. Gopalakrishnan, I. Hollein, Stuart Gough
Publikováno v:
25th European Mask and Lithography Conference.
Within the frame of the European R&D project the so called "HYMNE" project, lead by STM, advanced vacuum decontamination processes had been demonstrated to be efficient on wafer substrates in order to remove airborne molecular contamination (moisture
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::938fe03ac620be6e34c2de502fcd31ea
https://doi.org/10.1117/12.835172
https://doi.org/10.1117/12.835172
Autor:
D. Cheung, C. Rude, V. Baudiquez, Arnaud Favre, E. Foca, Magali Davenet, F. Dufaye, J. Palisson, Jean Marie Foray, S. Gopalakrishnan, Stuart Gough, I. Hollein, P. Richteiger, K. Avary, P. Nesladek
Publikováno v:
25th European Mask and Lithography Conference.
Contamination and especially Airbone Molecular Contamination (AMC) is a critical issue for mask material flow with a severe and fairly unpredictable risk of induced contamination and damages especially for 193 nm lithography. It is therefore essentia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58ab753da81fdb6d9ec815ec63983c91
https://doi.org/10.1117/12.835198
https://doi.org/10.1117/12.835198
Autor:
D. Cheung, Magali Davenet, H. Fontaine, K. Avary, Patrice Dejaune, T. Trautmann, Arnaud Favre, C. Rude, Stuart Gough, R. Lerit, Michel Tissier, M. Veillerot, Jean Marie Foray, I. Hollein, Pierre Sergent
Publikováno v:
SPIE Proceedings.
Context/ study Motivation: Contamination and especially Airbone Molecular Contamination (AMC) is a critical issue for mask material flow with a severe and fairly unpredictable risk of induced contamination and damages especially for 193 nm lithograph
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40704aa4df7734b632b3cdf26f8e51d7
https://doi.org/10.1117/12.798586
https://doi.org/10.1117/12.798586