Controlling interfacial exchanges in liquid phase bonding enables formation of strong and reliable Cu–Sn soldering for high-power and temperature applications

Autor: Jean-Marc Heintz, Emilien Feuillet, Jean-François Silvain, Loic Constantin, S. Bordère, Lionel Teule-Gay, Jean Luc Diot, Yongfeng Lu, Renaud de Langlade

Publikováno v: ACS Applied Electronic Materials
ACS Applied Electronic Materials, American Chemical Society, 2021, 3 (2), pp.921-928. ⟨10.1021/acsaelm.0c01040⟩

International audience; Developing solder joints capable of withstanding high power density, high temperature, and significant thermomechanical stress is essential to further develop electronic device performances. This study demonstrates an effectiv

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1c15bf86bce26a504bff733f822e1ae6
http://hdl.handle.net/20.500.12278/109614

Packaging des circuits intégrés

Autor: Jean-Luc Diot

Publikováno v: Électronique.

Le packaging a pour role d’etablir les interconnexions electriques, de permettre la protection de la puce microelectronique, la dissipation de chaleur et de garantir la fiabilite du composant. Cet article est entierement consacre au packaging des c

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1805af93f37d74c80fec2e9183409861
https://doi.org/10.51257/a-v2-e3400

Reduction of mechanical anisotropy in liquid crystal polymer based composite by functionalized silica nano-particles

Autor: Walide Chenniki, BORD MAJEK Isabelle, Mélanie Louarn, Vincent Gaud, Jean-Luc Diot, Komkrisd Wongtimnoi, Brunel, R., Yves Ousten

Publikováno v: Fourth International Conference on Multifunctional, Hybrid and Nanomaterials (Hybrid Materials 2015)
Fourth International Conference on Multifunctional, Hybrid and Nanomaterials (Hybrid Materials 2015), Mar 2015, Sitges, Spain
HAL

International audience; The development of a new generation of innovative thermoplastics for microelectronic and photonic applications is essential to make cavity packages able to compete with ceramic packages in terms of cost and design flexibility.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::bab24987fdd2abd45f9225d2cc4d2de5
https://hal.archives-ouvertes.fr/hal-01188923

Simulation of ultra-thin sheet metal forming using phenomenological and crystal plasticity models

Autor: Pierre-Yves Manach, Tudor Balan, Francis Adzima, Sébastien Toutain, Laurent Tabourot, Jean-Luc Diot

Publikováno v: Journal of Physics: Conference Series
Journal of Physics: Conference Series, IOP Publishing, 2016, 734, pp.032069. ⟨10.1088/1742-6596/734/3/032069⟩

International audience; Micro-forming of ultra-thin sheet metals raises numerous challenges. In this investigation, the predictions of state-of-the-art crystal plasticity (CP) and phenomenological models are compared in the framework of industrial be

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1ecabd77d233590470c36d10862245fe
https://doi.org/10.1088/1742-6596/734/3/032069

Comprehensive design analysis of QFN and PowerQFN packages for enhanced board level solder joint reliability

Autor: G. Frezza, G. Santospirito, Jean-Luc Diot, Tong Yan Tee, Hun Shen Ng, R. Tiziani

Publikováno v: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Board level solder joint reliability is a critical issue for Quad Flat Non-lead Package (QFN), a type of leadframe CSP, during the thermal cycling test. However, currently there are very few papers available on fatigue modeling and thermal cycling te

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::754d3f37473a8879241f1cebd3f44b52
https://doi.org/10.1109/ectc.2002.1008221