Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Je Gwang Yoo"'
Publikováno v:
2006 7th International Conference on Electronic Packaging Technology.
In the 1990's, both BGA (ball grid array) and CSP (chip size package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (surface mount device) from the 1980's and THD (through-hole mount dev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1440a5fbf047ef4d660a3e82c1c5c7ca
https://doi.org/10.1109/icept.2006.359648
https://doi.org/10.1109/icept.2006.359648
Publikováno v:
2006 7th International Conference on Electronic Packaging Technology.
Three methods for fabricating thin film capacitors are investigated using sputtering, sol-gel, and atomic layer deposition (ALD) techniques for advanced packaging applications for embedded capacitors. In particular, the microstructures and the electr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::19179e065ec4d6305034aa3824dac7db
https://doi.org/10.1109/icept.2006.359875
https://doi.org/10.1109/icept.2006.359875
Publikováno v:
Korean Journal of Materials Research. 19:349~355-349~355
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e35dd9d2feb7ae11275ac70f892e4a78
https://doi.org/10.3740/mrsk.2009.19.7.349
https://doi.org/10.3740/mrsk.2009.19.7.349
Publikováno v:
2006 8th Electronics Packaging Technology Conference; 2006, p10-14, 5p