Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Jaydeep Sarkar"'
Autor:
Jaydeep Sarkar
An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic devi
Publikováno v:
Science in China Series E: Technological Sciences. 52:79-87
In this study we have used a combinatorial approach for producing binary and ternary alloy thin film libraries using a lab-scale RF co-sputtering system. Initially we used two elemental sputtering targets, i.e. aluminum (Al) target and neodymium (Nd)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e1acd8969d682dffd984746ce78bb41
https://doi.org/10.1007/s11431-008-0326-z
https://doi.org/10.1007/s11431-008-0326-z
Publikováno v:
Asian Pacific Journal of Tropical Medicine. 5(6):500-502
Leptospirosis, long thought to be a disease of sewage workers and found post-flooding is re-emerging as a potentially life threatening infectious disease in urban India during monsoon and immediately after due to poor sanitation and drainage. However
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::684e9010fd2c4ee073413fcba0c0dfe1
Autor:
Jaydeep Sarkar
This chapter discusses role of sputtering target performance on overall productivity of a manufacturing process. Here, the term performance of a sputtering target is used to describe the ability of a sputtering target to deposit thin films with desir
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a07ef10930657d321c9711182168d843
https://doi.org/10.1016/b978-0-8155-1593-7.00003-5
https://doi.org/10.1016/b978-0-8155-1593-7.00003-5
Autor:
Jaydeep Sarkar
A wide variety of materials are sputtered either in pure or in reactive mode to form thin films on chosen substrates for microelectronic applications. Such sputtered thin films are used as silicide contacts, conductors, diffusion barriers, anti-refle
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a84e20184a9e3336293c8c0b903a41df
https://doi.org/10.1016/b978-0-8155-1593-7.00001-1
https://doi.org/10.1016/b978-0-8155-1593-7.00001-1
Autor:
Jaydeep Sarkar
A wide variety of materials are sputtered either in pure or in reactive mode to form thin films on chosen substrates for microelectronic applications. Such sputtered thin films are used as silicide contacts, conductors, diffusion barriers, anti-refle
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27253848abf4cfca0ada0d802ca68b5c
https://doi.org/10.1016/b978-0-8155-1593-7.00002-3
https://doi.org/10.1016/b978-0-8155-1593-7.00002-3
Autor:
Jaydeep Sarkar
In this chapter, a number of materials that are sputter deposited to form thin films for flat panel displays, in particular active matrix liquid crystal displays (AMLCDs) and photovoltaic solar cell modules are reviewed. Considering technology trends
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77a7f469e5aae9ba865d18900ad32a73
https://doi.org/10.1016/b978-0-8155-1593-7.00006-0
https://doi.org/10.1016/b978-0-8155-1593-7.00006-0
Autor:
Jaydeep Sarkar
This chapter reviews commercially important materials that are either sputtered in pure form (e.g., Al, Al-0.5Cu, Cu, NiV, Ti, W, W-Ti) or reactively (e.g., Ti, Ta) to form a variety of thin films for integrated circuit (IC) manufacturing. These sput
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f53da7fb05842eafb12bb0fb006043cf
https://doi.org/10.1016/b978-0-8155-1593-7.00005-9
https://doi.org/10.1016/b978-0-8155-1593-7.00005-9
Autor:
Jaydeep Sarkar
This chapter discusses sputtering target manufacturing essentials which include design concepts, metallurgical principles of target fabrication, elements of machining, bonding, bond evaluation, cleaning and packaging. Separate flow charts have been u
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8385f5917cac9145480decd04bae1ca0
https://doi.org/10.1016/b978-0-8155-1593-7.00004-7
https://doi.org/10.1016/b978-0-8155-1593-7.00004-7
Publikováno v:
Asian Pacific Journal of Tropical Medicine. 5:665-666
Most common cause of thalamic bleed is hypertension; other causes are arteriovenous malformation, aneurysm, bleeding diathesis, drugs, amyloid angiopathy, tumor etc. We present a case of Plasmodium vivax (P. vivax) malaria with unusual site of bleedi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cccf48a1ee01ce862f585bad67db1570
https://doi.org/10.1016/s1995-7645(12)60136-9
https://doi.org/10.1016/s1995-7645(12)60136-9