Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Jayanth Mekkoth"'
Autor:
Hao-Jan Chao, Venkat Ghanta, Kelvin Nelson, Shianling Wu, Jaga Shanmugavadivelu, Lizhen Yu, Jun Wu, Laung-Terng Wang, Jie Rao, Fe Zhuang, Jayanth Mekkoth
Publikováno v:
ISQED
This paper describes an application of a physical-design-friendly hierarchical logic built-in self-test (BIST) architecture and validation methodology on a networking system-on-chip (SOC) design. The design consists of two embedded cores, each contai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::acf1cfe8ad808d43560a7138c81bddc6
https://doi.org/10.1109/isqed.2012.6187466
https://doi.org/10.1109/isqed.2012.6187466
Autor:
Shianling Wu, Xiangfeng Li, Yuan Zuo, Junbo Jia, Xingang Wang, Jayanth Mekkoth, Huafeng Yang, Fei Zhuang, Jinsong Liu, Laung-Terng Wang, Jun Qian, Hao-Jan Chao, Qinfu Yang, Lizhen Yu, Feifei Zhao
Publikováno v:
Asian Test Symposium
This paper describes the logic built-in self-test (BIST) architecture for test and diagnosis of ASIC devices at the system level. The proposed architecture supports the at speed staggered launch-on-capture clocking scheme and includes novel features
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79fb88258a9178dc03234950eee62748
https://doi.org/10.1109/ats.2009.34
https://doi.org/10.1109/ats.2009.34
Autor:
Martin Keim, Yuan-Shih Chen, Chien-Hui Chen, Wu-Tung Cheng, Murali Krishna, Will Hsu, Jan Tofte, Nagesh Tamarapalli, Jun Qian, Jayanth Mekkoth
Publikováno v:
International Symposium for Testing and Failure Analysis.
Manufacturing yield is stable when the technology is mature. But, once in a while, excursions may occur due to variances in the large number of tools, materials, and people involved in the complex IC fabrication. Quickly identifying and correcting th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b46fb1a459f27463f0a1b141af73db56
https://doi.org/10.31399/asm.cp.istfa2006p0412
https://doi.org/10.31399/asm.cp.istfa2006p0412
Publikováno v:
Thirteenth International Symposium on Quality Electronic Design (ISQED); 1/ 1/2012, pxiii-xxi, 9p