Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Jay Santoki"'
Autor:
Yinghan Zhao, Patrick Altschuh, Jay Santoki, Lars Griem, Giovanna Tosato, Michael Selzer, Arnd Koeppe, Britta Nestler
Publikováno v:
Acta Materialia, 253, 118922
Autor:
Daniel Schneider, Jay Santoki, Simon Daubner, P.G. Kubendran Amos, Ephraim Schoof, Britta Nestler
Publikováno v:
Physical review materials, 5 (3), Article no: 035406
Owing to its unique thermodynamical description, phase separation has largely been modeled in the Cahn-Hilliard framework. In the present work, as a computationally efficient alternative, a multicomponent, multiphase-field model operating in Allen-Ca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a49e1e28844c3804cd20f39d08bae57f
https://publikationen.bibliothek.kit.edu/1000130756
https://publikationen.bibliothek.kit.edu/1000130756
Publikováno v:
Computational materials science, 173, Article No.109388
Preserving volume in the Allen-Cahn framework is appealing as a computationally-efficient alternate for Cahn-Hilliard approach. The limitations of adopting volume-preserved Allen-Cahn treatment to analyse curvature-driven morphological transformation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::679423f46d379a47bf55d151cb16fc31
Publikováno v:
Journal of the Electrochemical Society, 167 (13), 130526
This study demonstrates the synthesis of olivine LiNiPO4and carbon modified LiNiPO4(LNP/C-composites) cathode materials foruse in lithium-ion batteries (LIBs) synthesized via non aqueous sol-gel process. The LNP/C-composites were fabricated throughhi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fb345727008cc893ab8cde2e37bc3ae1
Publikováno v:
Journal of Electronic Materials. 48:182-193
Electromigration damage due to void propagation in thin films has garnered much attention due to its implications for efficient design of interconnects. Voids can drift along the line, preserving its shape, or evolve into various time-dependent confi
Publikováno v:
Journal of Applied Physics. 126:165305
The electromigration-induced microstructural evolution of inclusions such as voids, precipitates, and homoepitaxial islands is of technological importance to the reliability, the performance of the thin film interconnects, and surface nanoengineering
Publikováno v:
Modelling and Simulation in Materials Science and Engineering. 26:065013