Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Jason Saito"'
Autor:
Sivakumar Venkat, Ja-Chun Ku, Yong Shin, Carlotte Douglas, Scott Seo, SungKi Park, Jason Saito, Byeong-Sam Moon, KeunSu Kim, William Shen, Jeong-Hoon An, Hyo Sik Suh, Jonggeun Park, Jiae Kim, Sanghyun Lee
Publikováno v:
ECS Transactions. 16:321-329
This paper talks about a new class of yield impacting defect types known as polishing induced defects (PID) on polished silicon substrates. These defects were found to cause significant yield drop associated with a pump bias failure in the sub-60nm f
Publikováno v:
Rapid Prototyping Journal. 8:147-160
This paper presents the experimentation and modeling efforts at the University of Southern California, Los Angeles, to study the material flow patterns in the extrusion and deposition stages of the Contour Crafting (CC) process. A preliminary finite
Publikováno v:
Rapid Prototyping Journal. 7:32-42
This paper presents research about the adaptation of Contour Crafting, a novel prototyping process, for two carefully chosen uncured ceramic materials. The details of the construction and operation of the fabrication machine, as well as procedures an
Autor:
Aris Chen, Haiping Zhang, William Shen, Sophie Chen, Ming Li, Kevin Sun, C. J. Tsai, Henry Chen, Jason Saito, Victor Huang, Debbie Hu, Uday Mahajan, Kenneth Wu
Publikováno v:
SPIE Proceedings.
The impact of embedded substrate defects on end-of-line die yield has become significant for advanced process technology nodes. Quality control and grading of wafers intended for leading-edge devices thus require effective detection and identificatio